Smart integration and packaging of 2-D VCSEL's for high-speed parallel links

Hideo Kosaka

doi:10.1109/2944.778281

Smart integration and packaging of 2-D VCSEL's for high-speed parallel links

Hideo Kosaka

Research Institute of Electrical Communication (RIEC)

Research output: Contribution to journal › Article › peer-review

27 Citations (Scopus)

Abstract

This paper reviews recent progress in the integration and packaging of two-dimensional (2-D) vertical-cavity surface-emitting laser (VCSEL) arrays being developed for the use in high-speed parallel optical interconnections. It reviews the smart integration of VCSEL's with detecting, switching and latching functions through the integration of a VCSEL-thyristor and double-cavity phototransistor. It also describes self-alignment-packaging technologies for 2-D VCSEL module that can be used in high-density parallel links. Various system applications, such as a distributed fiber switch used to enable crossbar interconnections with address switching functions and hyper-parallel transmission using an image fiber, are also examined.

Original language	English
Pages (from-to)	184-192
Number of pages	9
Journal	IEEE Journal on Selected Topics in Quantum Electronics
Volume	5
Issue number	2
DOIs	https://doi.org/10.1109/2944.778281
Publication status	Published - 1999 Mar 1

ASJC Scopus subject areas

Atomic and Molecular Physics, and Optics
Electrical and Electronic Engineering

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Smart integration and packaging of 2-D VCSEL's for high-speed parallel links

Abstract

ASJC Scopus subject areas

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