This paper reviews recent progress in the integration and packaging of two-dimensional (2-D) vertical-cavity surface-emitting laser (VCSEL) arrays being developed for the use in high-speed parallel optical interconnections. It reviews the smart integration of VCSEL's with detecting, switching and latching functions through the integration of a VCSEL-thyristor and double-cavity phototransistor. It also describes self-alignment-packaging technologies for 2-D VCSEL module that can be used in high-density parallel links. Various system applications, such as a distributed fiber switch used to enable crossbar interconnections with address switching functions and hyper-parallel transmission using an image fiber, are also examined.
|Number of pages||9|
|Journal||IEEE Journal on Selected Topics in Quantum Electronics|
|Publication status||Published - 1999 Mar 1|
ASJC Scopus subject areas
- Atomic and Molecular Physics, and Optics
- Electrical and Electronic Engineering