Abstract
This paper reviews recent progress in the integration and packaging of two-dimensional (2-D) vertical-cavity surface-emitting laser (VCSEL) arrays being developed for the use in high-speed parallel optical interconnections. It reviews the smart integration of VCSEL's with detecting, switching and latching functions through the integration of a VCSEL-thyristor and double-cavity phototransistor. It also describes self-alignment-packaging technologies for 2-D VCSEL module that can be used in high-density parallel links. Various system applications, such as a distributed fiber switch used to enable crossbar interconnections with address switching functions and hyper-parallel transmission using an image fiber, are also examined.
| Original language | English |
|---|---|
| Pages (from-to) | 184-192 |
| Number of pages | 9 |
| Journal | IEEE Journal on Selected Topics in Quantum Electronics |
| Volume | 5 |
| Issue number | 2 |
| DOIs | |
| Publication status | Published - 1999 Mar |
| Externally published | Yes |
ASJC Scopus subject areas
- Atomic and Molecular Physics, and Optics
- Electrical and Electronic Engineering