Smaller surface acoustic wave duplexer for US personal communication service having good temperature characteristics

Takeshi Nakao, Michio Kadota, Kenji Nishiyama, Yasuharu Nakai, Daisuke Yamamoto, Yutaka Ishiura, Tomohisa Komura, Norihiko Takada, Ryoichi Kita

Research output: Contribution to journalArticlepeer-review

63 Citations (Scopus)

Abstract

Using a flattened SiO2/Cu electrode/36-48° LiTaO3 structure, a small (5 × 5 mm2) surface acoustic wave (SAW) duplexer with a good temperature coefficient of frequency (TCF) for US personal communication services (PCS) was realized by the authors. However, a smaller duplexer is strongly required. Using the flip-chip bonding process of SAW chips and a Rayleigh SAW propagating on a flattened SiO2/CU electrode/1.26-1.28° YX-LiNbO3 structure, which has a larger coupling factor than the above-mentioned substrate, a smaller (3 × 2.5 mm2) SAW duplexer with a good TCF was realized.

Original languageEnglish
Pages (from-to)4760-4763
Number of pages4
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume46
Issue number7 B
DOIs
Publication statusPublished - 2007 Jul 26

Keywords

  • Duplexer
  • Excellent TCF
  • PCS
  • Rayleigh SAW

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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