Small surface acoustic wave duplexer for wide-band code-division multiple access full-band system having good temperature characteristics

Michio Kadota, Takeshi Nakao, Kenji Nishiyama, Shunsuke Kido, Masanori Kato, Ryoichi Omote, Hiroshi Yonekura, Norihiko Takada, Ryoichi Kita

Research output: Contribution to journalArticlepeer-review

73 Citations (Scopus)

Abstract

A small surface acoustic wave (SAW) duplexer for a wide-band code-division multiple access (W-CDMA) system with a good temperature coefficient of frequency (TCF) has been required. However, the conventional SAW duplexer for W-CDMA using Al electrode/50-70° YX-LiNbO3 is large (3.8 x 3.8 mm 2) and its TCF is not good (-80ppm/°C). When a SiO2 film is deposited on this substrate to improve its TCF, good frequency characteristics cannot be realized. Thus, by using a new structure such as a flattened SiO2 film/Cu electrode/substrate structure to improve the TCF, YX-LiNbO3 substrate to obtain a large coupling factor, and flip-chip bonding to miniaturize the duplexer, a small (3 x 2.5 mm2) SAW duplexer having a low insertion loss and a good TCF has been realized for the first time.

Original languageEnglish
Pages (from-to)4714-4717
Number of pages4
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume46
Issue number7 B
DOIs
Publication statusPublished - 2007 Jul 26

Keywords

  • Duplexer
  • Excellent TCF
  • Love wave
  • W-CDMA

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

Fingerprint Dive into the research topics of 'Small surface acoustic wave duplexer for wide-band code-division multiple access full-band system having good temperature characteristics'. Together they form a unique fingerprint.

Cite this