Small 3 × 2.5mm2 sized surface acoustic wave duplexer for US-PCS with excellent temperature and frequency characteristics

Takeshi Nakao, Michio Kadota, Kenji Nishiyama, Yasuharu Nakai, Daisuke Yamamoto, Yutaka Ishiura, Tomohisa Komura, Norihiko Takada, Ryoichi Kita

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

Using flattened-SiO2/Cu-electrode/36-48° LiTaO3 structure, small size (5 × 5mm2) surface acoustic wave (SAW) duplexer with a good temperature coefficient of frequency (TCF) for US-PCS was realized by authors. However, a smaller duplexer has been strongly required. Using flip-chip bonding process of SAW chips and Rayleigh SAW propagating on the flattened-SiO2/Cu-electrode/126-128°YX-LiNbO3, which has larger coupling factor than above-mentioned substrate, a smaller sized (3×2.5mm2) SAW duplexer with a good TCF has been realized.

Original languageEnglish
Title of host publication2007 IEEE Ultrasonics Symposium Proceedings, IUS
Pages1681-1684
Number of pages4
DOIs
Publication statusPublished - 2007 Dec 1
Event2007 IEEE Ultrasonics Symposium, IUS - New York, NY, United States
Duration: 2007 Oct 282007 Oct 31

Publication series

NameProceedings - IEEE Ultrasonics Symposium
ISSN (Print)1051-0117

Other

Other2007 IEEE Ultrasonics Symposium, IUS
CountryUnited States
CityNew York, NY
Period07/10/2807/10/31

ASJC Scopus subject areas

  • Acoustics and Ultrasonics

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