Small 3 × 2.5mm2 sized surface acoustic wave duplexer for US-PCS with excellent temperature and frequency characteristics

Takeshi Nakao; Michio Kadota; Kenji Nishiyama; Yasuharu Nakai; Daisuke Yamamoto; Yutaka Ishiura; Tomohisa Komura; Norihiko Takada; Ryoichi Kita

doi:10.1109/ULTSYM.2007.423

Small 3 × 2.5mm² sized surface acoustic wave duplexer for US-PCS with excellent temperature and frequency characteristics

Takeshi Nakao, Michio Kadota, Kenji Nishiyama, Yasuharu Nakai, Daisuke Yamamoto, Yutaka Ishiura, Tomohisa Komura, Norihiko Takada, Ryoichi Kita

ENG - Robotics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

8 Citations (Scopus)

Abstract

Using flattened-SiO₂/Cu-electrode/36-48° LiTaO₃ structure, small size (5 × 5mm²) surface acoustic wave (SAW) duplexer with a good temperature coefficient of frequency (TCF) for US-PCS was realized by authors. However, a smaller duplexer has been strongly required. Using flip-chip bonding process of SAW chips and Rayleigh SAW propagating on the flattened-SiO₂/Cu-electrode/126-128°YX-LiNbO₃, which has larger coupling factor than above-mentioned substrate, a smaller sized (3×2.5mm²) SAW duplexer with a good TCF has been realized.

Original language	English
Title of host publication	2007 IEEE Ultrasonics Symposium Proceedings, IUS
Pages	1681-1684
Number of pages	4
DOIs	https://doi.org/10.1109/ULTSYM.2007.423
Publication status	Published - 2007 Dec 1
Event	2007 IEEE Ultrasonics Symposium, IUS - New York, NY, United States Duration: 2007 Oct 28 → 2007 Oct 31

Publication series

Name	Proceedings - IEEE Ultrasonics Symposium
ISSN (Print)	1051-0117

Other

Other	2007 IEEE Ultrasonics Symposium, IUS
Country/Territory	United States
City	New York, NY
Period	07/10/28 → 07/10/31

ASJC Scopus subject areas

Acoustics and Ultrasonics

Access to Document

10.1109/ULTSYM.2007.423

Cite this

Nakao, T., Kadota, M., Nishiyama, K., Nakai, Y., Yamamoto, D., Ishiura, Y., Komura, T., Takada, N., & Kita, R. (2007). Small 3 × 2.5mm² sized surface acoustic wave duplexer for US-PCS with excellent temperature and frequency characteristics. In 2007 IEEE Ultrasonics Symposium Proceedings, IUS (pp. 1681-1684). [4409996] (Proceedings - IEEE Ultrasonics Symposium). https://doi.org/10.1109/ULTSYM.2007.423

Small 3 × 2.5mm² sized surface acoustic wave duplexer for US-PCS with excellent temperature and frequency characteristics. / Nakao, Takeshi; Kadota, Michio; Nishiyama, Kenji et al.

2007 IEEE Ultrasonics Symposium Proceedings, IUS. 2007. p. 1681-1684 4409996 (Proceedings - IEEE Ultrasonics Symposium).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Nakao, T, Kadota, M, Nishiyama, K, Nakai, Y, Yamamoto, D, Ishiura, Y, Komura, T, Takada, N & Kita, R 2007, Small 3 × 2.5mm² sized surface acoustic wave duplexer for US-PCS with excellent temperature and frequency characteristics. in 2007 IEEE Ultrasonics Symposium Proceedings, IUS., 4409996, Proceedings - IEEE Ultrasonics Symposium, pp. 1681-1684, 2007 IEEE Ultrasonics Symposium, IUS, New York, NY, United States, 07/10/28. https://doi.org/10.1109/ULTSYM.2007.423

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abstract = "Using flattened-SiO2/Cu-electrode/36-48° LiTaO3 structure, small size (5 × 5mm2) surface acoustic wave (SAW) duplexer with a good temperature coefficient of frequency (TCF) for US-PCS was realized by authors. However, a smaller duplexer has been strongly required. Using flip-chip bonding process of SAW chips and Rayleigh SAW propagating on the flattened-SiO2/Cu-electrode/126-128°YX-LiNbO3, which has larger coupling factor than above-mentioned substrate, a smaller sized (3×2.5mm2) SAW duplexer with a good TCF has been realized.",

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AU - Yamamoto, Daisuke

AU - Ishiura, Yutaka

AU - Komura, Tomohisa

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