Skin effect suppressed NiFe/Cu electroplated multilayer wiring for high data-rate and low delay-time I/O interface board

M. Yamaguchi, T. Yanai, H. Nakayama, R. Sai, H. Fujiwara, Y. Kitai, M. Sato, U. Sangawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper proposes a new application of skin effect suppression technology [1]-[4] for long wiring on high-speed & low-delay I/O board (typical wiring length; 200 to 1000 mm). This proposal will overcome the difficulty to further reduce the transmission losses on the I/O board with >50 Gbps data rate, which is currently performed by lowering dielectric substrate losses and surface smoothing of Cu conductor. A major challenge in this paper is to demonstrate the skin effect suppression by electroplated magnetic/conductor multilayer, instead of sputter-deposited thin film in literature [2]-[4], in order to meet coming cost-effective, thick (>5 μm), large area, and high throughput mass productivity requirements. High frequency (>10 GHz) estimation of complex permeability and measurements of low resistance devices are also investigated.

Original languageEnglish
Title of host publication2018 IEEE International Magnetic Conference, INTERMAG 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538664254
DOIs
Publication statusPublished - 2018 Oct 24
Event2018 IEEE International Magnetic Conference, INTERMAG 2018 - Singapore, Singapore
Duration: 2018 Apr 232018 Apr 27

Publication series

Name2018 IEEE International Magnetic Conference, INTERMAG 2018

Other

Other2018 IEEE International Magnetic Conference, INTERMAG 2018
CountrySingapore
CitySingapore
Period18/4/2318/4/27

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation

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