Skin Effect Suppressed Ni-Fe/Cu Electroplated Multilayer Wiring for High Data-Rate and Low Delay-Time I/O Interface Board

Masahiro Yamaguchi, Takeshi Yanai, Hidetoshi Nakayama, Ranajit Sai, Hiroaki Fujiwara, Yuki Kitai, Mikio Sato, Ushio Sangawa

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

Application of negative permeability beyond ferromagnetic resonance frequency is discussed in this paper. Targeted application is the skin effect suppression technology for long wiring on high-speed and low-delay I/O board. An 11.9 μ m-thick Ni-Fe/Cu multilayer consisting of 0.25 μ m-thick Ni-Fe and 0.51 μ m-thick Cu in turn was electroplated, patterned into 609 μ m-wide and 40 mm-long signal line of microstrip line (MSL) on a 250 μ m-thick printed circuit board. Targeted frequency was 15 GHz, where relative real part permeability was supposed to be-2. The 40 mm-long Ni-Fe/Cu multilayer exhibited the insertion as small as 0.7 dB up to 25 GHz, which is almost the same as the copper monolayer MSL of the same geometry.

Original languageEnglish
Article number8458383
JournalIEEE Transactions on Magnetics
Volume54
Issue number11
DOIs
Publication statusPublished - 2018 Nov

Keywords

  • Electroplated multilayer
  • I/O interface board
  • Ni-Fe
  • skin effect suppression

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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