@inproceedings{a87e91c5e53141a4809be9b4505d7432,
title = "Sintered Ferrite Thin Plate Noise Suppressor Mounted on IC Chip Interposer",
abstract = "NiCuZn spinel ferrite particles were sintered into 50 m-thick plate and mounted in between IC die and its interposer to explore their suitability as electromagnetic noise suppressor up to 10 GHz. A 50 m thick Y-Type hexaferrite plate with density of 5.2 g/cm3 exhibits the figure-of-merit, Ploss/Pin, as high as 0.27 at 7 GHz. The test ferrite plate was embedded in between IC chip and interposer using a newly developed pre-assembly technique. This was enough to suppress on-chip conduction noise and corresponding near field emission by 4-17 dB in wireless communication channels.",
keywords = "EMC, complex permeability, hexagonal ferrite, high frequency, input loss ratio, receiver sensitivity, sintering",
author = "Masahiro Yamaguchi and Akihiro Takahashi and Yasunori Miyazawa and Koh Watanabe and Kosuke Jike and Satoshi Tanaka and Noriyuki Miura and Makoto Nagata",
year = "2019",
month = oct,
doi = "10.1109/EMCCompo.2019.8919832",
language = "English",
series = "EMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "231--233",
booktitle = "EMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits",
note = "12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2019 ; Conference date: 21-10-2019 Through 23-10-2019",
}