Sintered Ferrite Thin Plate Noise Suppressor Mounted on IC Chip Interposer

Masahiro Yamaguchi, Akihiro Takahashi, Yasunori Miyazawa, Koh Watanabe, Kosuke Jike, Satoshi Tanaka, Noriyuki Miura, Makoto Nagata

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

NiCuZn spinel ferrite particles were sintered into 50 m-thick plate and mounted in between IC die and its interposer to explore their suitability as electromagnetic noise suppressor up to 10 GHz. A 50 m thick Y-Type hexaferrite plate with density of 5.2 g/cm3 exhibits the figure-of-merit, Ploss/Pin, as high as 0.27 at 7 GHz. The test ferrite plate was embedded in between IC chip and interposer using a newly developed pre-assembly technique. This was enough to suppress on-chip conduction noise and corresponding near field emission by 4-17 dB in wireless communication channels.

Original languageEnglish
Title of host publicationEMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages231-233
Number of pages3
ISBN (Electronic)9781728142616
DOIs
Publication statusPublished - 2019 Oct
Event12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2019 - Haining, Hangzhou, China
Duration: 2019 Oct 212019 Oct 23

Publication series

NameEMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits

Conference

Conference12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2019
CountryChina
CityHaining, Hangzhou
Period19/10/2119/10/23

Keywords

  • EMC
  • complex permeability
  • hexagonal ferrite
  • high frequency
  • input loss ratio
  • receiver sensitivity
  • sintering

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Radiation

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