Single-chip integration of light-emitting diode, waveguide and micromirrors

Seiichi Miyazaki, Masataka Hirose, Takahiko Nagata, Tohru Namba, Yasuhide Kuroda, Kouji Miyake, Takahiro Miyamoto, Shin Yokoyama, Mitsumasa Koyanag

Research output: Contribution to journalArticle

12 Citations (Scopus)

Abstract

Fundamental technologies for optical interconnection on a Si LSI chip have been developed using conventional silicon process technologies. The optical waveguides with SiOxNy core and SiO2 cladding layers and A1 micromirrors to change the light propagation direction have been fabricated by low-temperature deposition. Moreover, the single test chip integrated with a light-emitting diode (LED), photodiode, waveguides and micromirrors has been fabricated and signal transfer between LED and the photodetector has been achieved.

Original languageEnglish
Pages (from-to)1282-1285
Number of pages4
JournalJapanese journal of applied physics
Volume34
Issue number2S
DOIs
Publication statusPublished - 1995 Feb

Keywords

  • LED
  • Low-temperature chemical vapor deposition
  • Micromirror
  • Optical waveguide
  • Optoelectronic integrated circuits
  • Single-chip integration

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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  • Cite this

    Miyazaki, S., Hirose, M., Nagata, T., Namba, T., Kuroda, Y., Miyake, K., Miyamoto, T., Yokoyama, S., & Koyanag, M. (1995). Single-chip integration of light-emitting diode, waveguide and micromirrors. Japanese journal of applied physics, 34(2S), 1282-1285. https://doi.org/10.1143/JJAP.34.1282