Fundamental technologies for optical interconnection on a Si LSI chip have been developed using conventional silicon process technologies. The optical waveguides with SiOxNy core and SiO2 cladding layers and A1 micromirrors to change the light propagation direction have been fabricated by low-temperature deposition. Moreover, the single test chip integrated with a light-emitting diode (LED), photodiode, waveguides and micromirrors has been fabricated and signal transfer between LED and the photodetector has been achieved.
- Low-temperature chemical vapor deposition
- Optical waveguide
- Optoelectronic integrated circuits
- Single-chip integration
ASJC Scopus subject areas
- Physics and Astronomy(all)