Simultaneous molding and low-temperature bonding of Au microstructures for fabrication of micromirrors on non-silicon substrates

Seiya Matsuoka; Eiji Higurashi; Tadatomo Suga; Renshi Sawada

doi:10.1109/OMN.2016.7565926

Simultaneous molding and low-temperature bonding of Au microstructures for fabrication of micromirrors on non-silicon substrates

Seiya Matsuoka, Eiji Higurashi, Tadatomo Suga, Renshi Sawada

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

In order to realize micromirrors on non-silicon substrates, low-temperature bonding method of Au microrods (diameter: 100-130 μm) using glass molds is presented. First, a target substrate with an Au thin film and the Au microrod were surface activated using hydrogen plasma. Then, the Au microrod was pressed against the target substrate using the glass mold at 150 °C in ambient air. The Au microrod was plastically deformed and smooth surface (11 nm rms) was successfully fabricated on the Au microrod. Using the glass as the mold material, molding and Au-Au bonding were performed in one processing step.

Original language	English
Title of host publication	2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings
Publisher	IEEE Computer Society
ISBN (Electronic)	9781509010356
DOIs	https://doi.org/10.1109/OMN.2016.7565926
Publication status	Published - 2016 Sept 13
Externally published	Yes
Event	21st International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Singapore, Singapore Duration: 2016 Jul 31 → 2016 Aug 4

Publication series

Name	International Conference on Optical MEMS and Nanophotonics
Volume	2016-September
ISSN (Print)	2160-5033
ISSN (Electronic)	2160-5041

Other

Other	21st International Conference on Optical MEMS and Nanophotonics, OMN 2016
Country/Territory	Singapore
City	Singapore
Period	16/7/31 → 16/8/4

Keywords

deformation
Low-temperature bonding
micromirrors
molding

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/OMN.2016.7565926

Cite this

Matsuoka, S., Higurashi, E., Suga, T., & Sawada, R. (2016). Simultaneous molding and low-temperature bonding of Au microstructures for fabrication of micromirrors on non-silicon substrates. In 2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings [7565926] (International Conference on Optical MEMS and Nanophotonics; Vol. 2016-September). IEEE Computer Society. https://doi.org/10.1109/OMN.2016.7565926

Simultaneous molding and low-temperature bonding of Au microstructures for fabrication of micromirrors on non-silicon substrates. / Matsuoka, Seiya; Higurashi, Eiji; Suga, Tadatomo et al.

2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings. IEEE Computer Society, 2016. 7565926 (International Conference on Optical MEMS and Nanophotonics; Vol. 2016-September).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Matsuoka, S, Higurashi, E, Suga, T & Sawada, R 2016, Simultaneous molding and low-temperature bonding of Au microstructures for fabrication of micromirrors on non-silicon substrates. in 2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings., 7565926, International Conference on Optical MEMS and Nanophotonics, vol. 2016-September, IEEE Computer Society, 21st International Conference on Optical MEMS and Nanophotonics, OMN 2016, Singapore, Singapore, 16/7/31. https://doi.org/10.1109/OMN.2016.7565926

Matsuoka S, Higurashi E, Suga T, Sawada R. Simultaneous molding and low-temperature bonding of Au microstructures for fabrication of micromirrors on non-silicon substrates. In 2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings. IEEE Computer Society. 2016. 7565926. (International Conference on Optical MEMS and Nanophotonics). doi: 10.1109/OMN.2016.7565926

Matsuoka, Seiya ; Higurashi, Eiji ; Suga, Tadatomo et al. / Simultaneous molding and low-temperature bonding of Au microstructures for fabrication of micromirrors on non-silicon substrates. 2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings. IEEE Computer Society, 2016. (International Conference on Optical MEMS and Nanophotonics).

@inproceedings{eb793a875427465cafb5a8c259c0bf12,

title = "Simultaneous molding and low-temperature bonding of Au microstructures for fabrication of micromirrors on non-silicon substrates",

abstract = "In order to realize micromirrors on non-silicon substrates, low-temperature bonding method of Au microrods (diameter: 100-130 μm) using glass molds is presented. First, a target substrate with an Au thin film and the Au microrod were surface activated using hydrogen plasma. Then, the Au microrod was pressed against the target substrate using the glass mold at 150 °C in ambient air. The Au microrod was plastically deformed and smooth surface (11 nm rms) was successfully fabricated on the Au microrod. Using the glass as the mold material, molding and Au-Au bonding were performed in one processing step.",

keywords = "deformation, Low-temperature bonding, micromirrors, molding",

author = "Seiya Matsuoka and Eiji Higurashi and Tadatomo Suga and Renshi Sawada",

note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 21st International Conference on Optical MEMS and Nanophotonics, OMN 2016 ; Conference date: 31-07-2016 Through 04-08-2016",

year = "2016",

month = sep,

day = "13",

doi = "10.1109/OMN.2016.7565926",

language = "English",

series = "International Conference on Optical MEMS and Nanophotonics",

publisher = "IEEE Computer Society",

booktitle = "2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings",

}

TY - GEN

T1 - Simultaneous molding and low-temperature bonding of Au microstructures for fabrication of micromirrors on non-silicon substrates

AU - Matsuoka, Seiya

AU - Higurashi, Eiji

AU - Suga, Tadatomo

AU - Sawada, Renshi

PY - 2016/9/13

Y1 - 2016/9/13

N2 - In order to realize micromirrors on non-silicon substrates, low-temperature bonding method of Au microrods (diameter: 100-130 μm) using glass molds is presented. First, a target substrate with an Au thin film and the Au microrod were surface activated using hydrogen plasma. Then, the Au microrod was pressed against the target substrate using the glass mold at 150 °C in ambient air. The Au microrod was plastically deformed and smooth surface (11 nm rms) was successfully fabricated on the Au microrod. Using the glass as the mold material, molding and Au-Au bonding were performed in one processing step.

AB - In order to realize micromirrors on non-silicon substrates, low-temperature bonding method of Au microrods (diameter: 100-130 μm) using glass molds is presented. First, a target substrate with an Au thin film and the Au microrod were surface activated using hydrogen plasma. Then, the Au microrod was pressed against the target substrate using the glass mold at 150 °C in ambient air. The Au microrod was plastically deformed and smooth surface (11 nm rms) was successfully fabricated on the Au microrod. Using the glass as the mold material, molding and Au-Au bonding were performed in one processing step.

KW - deformation

KW - Low-temperature bonding

KW - micromirrors

KW - molding

UR - http://www.scopus.com/inward/record.url?scp=84990179749&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84990179749&partnerID=8YFLogxK

U2 - 10.1109/OMN.2016.7565926

DO - 10.1109/OMN.2016.7565926

M3 - Conference contribution

AN - SCOPUS:84990179749

T3 - International Conference on Optical MEMS and Nanophotonics

BT - 2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings

PB - IEEE Computer Society

T2 - 21st International Conference on Optical MEMS and Nanophotonics, OMN 2016

Y2 - 31 July 2016 through 4 August 2016

ER -

Simultaneous molding and low-temperature bonding of Au microstructures for fabrication of micromirrors on non-silicon substrates

Abstract

Publication series

Other

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this