Simple crack propagation model of pressure-sensitive adhesives

Shinobu Sekine, Toshihiro Kawakatsu

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

We propose a simple mechanical model describing viscoelasticity, cavitation growth and crack propagation during the debonding process in pressure-sensitive adhesives (PSAs). Typical materials of PSA are made of block copolymers and they are usually very soft and highly dissipative, and can stick on a variety of surfaces under low pressure in short time. The debonding process of PSA is governed by very complicated dynamics, for example, deformation of the adhesive layer, cavity expansion and coalescence. Our model is a modified version of that proposed by Yamaguchi et al (2006 Eur. Phys. J. E 20 7). We extended his simple model to be applicable to the final rupture process and applied the model to some cases, where we studied the effects of the change of PSA layer's thickness, separation speed and friction coefficient. Our results are qualitatively in good agreement with the experimental data.

Original languageEnglish
Article number025016
JournalAdvances in Natural Sciences: Nanoscience and Nanotechnology
Volume4
Issue number2
DOIs
Publication statusPublished - 2013 Jun

Keywords

  • Cavity expansion
  • Crack propagation
  • PSA

ASJC Scopus subject areas

  • Materials Science(all)
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Simple crack propagation model of pressure-sensitive adhesives'. Together they form a unique fingerprint.

Cite this