Silicon migration seal wafer-level vacuum encapsulation

Yukio Suzuki, Victor Dupuit, Toshiya Kojima, Yoshiaki Kanamori, Shuji Tanaka

Research output: Contribution to journalArticlepeer-review

Abstract

Silicon migration seal (SMS) wafer-level packaging is proposed for high vacuum encapsulation of MEMS. The sealing of vent holes is possible based on silicon surface migration effect at 1100°C in 100% hydrogen ambient without deposition, if the size of the vent holes is properly designed. The feasibility of SMS packaging was experimentally demonstrated using 4-inch wafers. Hermetic sealing was confirmed after 168 hours from the packaging process by diaphragm displacement in the cap wafer.

Original languageEnglish
Pages (from-to)120-125
Number of pages6
JournalElectronics and Communications in Japan
Volume104
Issue number1
DOIs
Publication statusPublished - 2021 Mar

Keywords

  • Epi-Seal
  • hydrogen anneal
  • silicon migration
  • vacuum sealing
  • wafer-level packaging

ASJC Scopus subject areas

  • Signal Processing
  • Physics and Astronomy(all)
  • Computer Networks and Communications
  • Electrical and Electronic Engineering
  • Applied Mathematics

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