Silicon micromachining for integrated microsystems

M. Esashi

Research output: Contribution to journalArticlepeer-review

16 Citations (Scopus)


Small sized but relatively complicated intelligent systems or subsystems were fabricated based on silicon micromachining. Packaged micromechanical sensors as extremely sensitive resonant sensors, accelerometers and a silicon diaphragm capacitive vacuum sensor were developed. A two-dimensional electromagnetic optical scanner was also developed. The vacuum pressures in the packaged cavities of these devices were well controlled. Microflow control systems which have bakable microvalves were fabricated for advanced semiconductor processes. Novel three-dimensional microfabrication methods were developed for silicon micromachining.

Original languageEnglish
Pages (from-to)469-474
Number of pages6
Issue number6-8
Publication statusPublished - 1996
Externally publishedYes


  • Accelerometer
  • Microactuator
  • Micromachining
  • Microsystems
  • Sensors

ASJC Scopus subject areas

  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films


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