Silicon carbide microfabrication by silicon lost molding for glass press molds

T. Itoh, S. Tanaka, Jing Feng Li, R. Watanabe, M. Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Two novel silicon carbide (SiC) microfabrication processes for SiC glass-press molds were developed. One is silicon lost molding combined with SiC chemical vapor deposition (CVD) and SiC reaction-sintering (RS). A SiC film was deposited on a micromachined silicon mold, and backed with a SiC reaction-sintered body. The surface roughness of the SiC mold was 0.05-0.08 μm Ra, and worse than required by the glass-press mold. This was caused by poly-crystal SiC growth during hot isotropic pressing (HIP), which was confirmed from X-ray diffraction (XRD) patterns of the CVD SiC film before/after HIP. The other is silicon lost molding combined with SiC-CVD and SiC solid-state reaction bonding (SSRB). A SiC film deposited on the micromachined silicon mold was bonded with a SiC ceramic substrate using a Ni interface layer. The surface of the SiC mold was very smooth (0.004-0.008 μm Ra) without poly-crystallization of the CVD SiC film. The SiC mold was pressed to a glass to confirm its high-temperature strength. The Pyrex glass was shaped by the SiC mold without a void, and no damage to the SiC mold was observed.

Original languageEnglish
Title of host publicationTRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages254-257
Number of pages4
ISBN (Electronic)0780377311, 9780780377318
DOIs
Publication statusPublished - 2003 Jan 1
Event12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers - Boston, United States
Duration: 2003 Jun 82003 Jun 12

Publication series

NameTRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
Volume1

Other

Other12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers
CountryUnited States
CityBoston
Period03/6/803/6/12

Keywords

  • Bonding
  • Chemical vapor deposition
  • Glass
  • Hip
  • Pressing
  • Rough surfaces
  • Semiconductor films
  • Silicon carbide
  • Surface roughness
  • X-ray diffraction

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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