Side-channel leakage on silicon substrate of CMOS cryptographic chip

Daisuke Fujimoto, Daichi Tanaka, Noriyuki Miura, Makoto Nagata, Yu-Ichi Hayashi, Naofumi Homma, Shivam Bhasin, Jean Luc Danger

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

Power supply currents of CMOS digital circuits partly flow through a silicon substrate in their returning (ground) paths. The voltage bounce due to the substrate currents is seen wherever p+ substrate taps on a p-type die and regarded as a substrate noise. An on-chip waveform monitor confirms the side-channel leakage on the silicon substrate from an AES cryptographic module in a 65 nm CMOS demonstrator chip for the first time. The silicon substrate is essentially common to every circuit and inevitably carries the leakage to the observation taps located at the front as well as at the bottom surface of a die, even if the power and ground wires of an AES module are intentionally separated from the other building blocks. Substrate leakage channels may break the hiding of a cryptographic module regarding its location on a die. The physical properties including the distance dependency are experimentally explored.

Original languageEnglish
Title of host publicationProceedings of the 2014 IEEE International Symposium on Hardware-Oriented Security and Trust, HOST 2014
PublisherIEEE Computer Society
Pages32-37
Number of pages6
ISBN (Print)9781479941148
DOIs
Publication statusPublished - 2014 Jan 1
Event2014 IEEE International Symposium on Hardware-Oriented Security and Trust, HOST 2014 - Arlington, VA, United States
Duration: 2014 May 62014 May 7

Publication series

NameProceedings of the 2014 IEEE International Symposium on Hardware-Oriented Security and Trust, HOST 2014

Other

Other2014 IEEE International Symposium on Hardware-Oriented Security and Trust, HOST 2014
CountryUnited States
CityArlington, VA
Period14/5/614/5/7

ASJC Scopus subject areas

  • Hardware and Architecture
  • Safety, Risk, Reliability and Quality

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