Si wafer bending technology for a three dimensional micro optical bench

M. Ishimori; J. H. Song; M. Sasaki; Kazuhiro Hane

doi:10.1109/IMNC.2002.1178676

Si wafer bending technology for a three dimensional micro optical bench

M. Ishimori, J. H. Song, M. Sasaki, Kazuhiro Hane

ENG - Finemechanics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A new technique for Si wafer bending is developed for making a 3D micro optical bench (MOB). This method has freedom in the bending angle by changing the jig. This in combination with the usual machining technique eliminates the complex micromachining process, taking advantage of the 3D structure.

Original language	English
Title of host publication	2002 International Microprocesses and Nanotechnology Conference, MNC 2002
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	328-329
Number of pages	2
ISBN (Print)	4891140313, 9784891140311
DOIs	https://doi.org/10.1109/IMNC.2002.1178676
Publication status	Published - 2002
Event	International Microprocesses and Nanotechnology Conference, MNC 2002 - Tokyo, Japan Duration: 2002 Nov 6 → 2002 Nov 8

Other

Other	International Microprocesses and Nanotechnology Conference, MNC 2002
Country/Territory	Japan
City	Tokyo
Period	02/11/6 → 02/11/8

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/IMNC.2002.1178676

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Si wafer bending technology for a three dimensional micro optical bench. / Ishimori, M.; Song, J. H.; Sasaki, M.; Hane, Kazuhiro.

2002 International Microprocesses and Nanotechnology Conference, MNC 2002. Institute of Electrical and Electronics Engineers Inc., 2002. p. 328-329 1178676.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ishimori, M, Song, JH, Sasaki, M & Hane, K 2002, Si wafer bending technology for a three dimensional micro optical bench. in 2002 International Microprocesses and Nanotechnology Conference, MNC 2002., 1178676, Institute of Electrical and Electronics Engineers Inc., pp. 328-329, International Microprocesses and Nanotechnology Conference, MNC 2002, Tokyo, Japan, 02/11/6. https://doi.org/10.1109/IMNC.2002.1178676

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title = "Si wafer bending technology for a three dimensional micro optical bench",

abstract = "A new technique for Si wafer bending is developed for making a 3D micro optical bench (MOB). This method has freedom in the bending angle by changing the jig. This in combination with the usual machining technique eliminates the complex micromachining process, taking advantage of the 3D structure.",

author = "M. Ishimori and Song, {J. H.} and M. Sasaki and Kazuhiro Hane",

year = "2002",

doi = "10.1109/IMNC.2002.1178676",

language = "English",

isbn = "4891140313",

pages = "328--329",

booktitle = "2002 International Microprocesses and Nanotechnology Conference, MNC 2002",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "International Microprocesses and Nanotechnology Conference, MNC 2002 ; Conference date: 06-11-2002 Through 08-11-2002",

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AU - Ishimori, M.

AU - Song, J. H.

AU - Sasaki, M.

AU - Hane, Kazuhiro

PY - 2002

Y1 - 2002

N2 - A new technique for Si wafer bending is developed for making a 3D micro optical bench (MOB). This method has freedom in the bending angle by changing the jig. This in combination with the usual machining technique eliminates the complex micromachining process, taking advantage of the 3D structure.

AB - A new technique for Si wafer bending is developed for making a 3D micro optical bench (MOB). This method has freedom in the bending angle by changing the jig. This in combination with the usual machining technique eliminates the complex micromachining process, taking advantage of the 3D structure.

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DO - 10.1109/IMNC.2002.1178676

M3 - Conference contribution

AN - SCOPUS:84960394559

SN - 4891140313

SN - 9784891140311

SP - 328

EP - 329

BT - 2002 International Microprocesses and Nanotechnology Conference, MNC 2002

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - International Microprocesses and Nanotechnology Conference, MNC 2002

Y2 - 6 November 2002 through 8 November 2002

ER -

Si wafer bending technology for a three dimensional micro optical bench

Abstract

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ASJC Scopus subject areas

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