Abstract
A new technique for Si wafer bending is developed for making a 3D micro optical bench (MOB). This method has freedom in the bending angle by changing the jig. This in combination with the usual machining technique eliminates the complex micromachining process, taking advantage of the 3D structure.
Original language | English |
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Title of host publication | 2002 International Microprocesses and Nanotechnology Conference, MNC 2002 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 328-329 |
Number of pages | 2 |
ISBN (Print) | 4891140313, 9784891140311 |
DOIs | |
Publication status | Published - 2002 |
Event | International Microprocesses and Nanotechnology Conference, MNC 2002 - Tokyo, Japan Duration: 2002 Nov 6 → 2002 Nov 8 |
Other
Other | International Microprocesses and Nanotechnology Conference, MNC 2002 |
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Country/Territory | Japan |
City | Tokyo |
Period | 02/11/6 → 02/11/8 |
ASJC Scopus subject areas
- Hardware and Architecture
- Electrical and Electronic Engineering