Si wafer bending technology for a three dimensional micro optical bench

M. Ishimori, J. H. Song, M. Sasaki, Kazuhiro Hane

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A new technique for Si wafer bending is developed for making a 3D micro optical bench (MOB). This method has freedom in the bending angle by changing the jig. This in combination with the usual machining technique eliminates the complex micromachining process, taking advantage of the 3D structure.

Original languageEnglish
Title of host publication2002 International Microprocesses and Nanotechnology Conference, MNC 2002
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages328-329
Number of pages2
ISBN (Print)4891140313, 9784891140311
DOIs
Publication statusPublished - 2002
EventInternational Microprocesses and Nanotechnology Conference, MNC 2002 - Tokyo, Japan
Duration: 2002 Nov 62002 Nov 8

Other

OtherInternational Microprocesses and Nanotechnology Conference, MNC 2002
CountryJapan
CityTokyo
Period02/11/602/11/8

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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