TY - GEN
T1 - Si Nanopillar/SiGe Composite Structure for Thermally Managed Nano-devices
AU - Ohori, Daisuke
AU - Murata, Masayuki
AU - Yamamoto, Atsushi
AU - Endo, Kazuhiko
AU - Chuang, Min Hui
AU - Lee, Ming Yi
AU - Li, Yiming
AU - Tarng, Jenn Hwan
AU - Lee, Yao Jen
AU - Samukawa, Seiji
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/7/28
Y1 - 2021/7/28
N2 - We have demonstrated a thermally managed Si nanopillar/SiGe composite structure. Our fabricated defect-free Si nanopillar channel structure showed a 1/100 times lower thermal conductivity than Si bulk thanks to the control of the phonon transports. The results of thermal conductivity measurements clarified that the nanopillar structure could eliminate electron-phonon scattering. As such, this structure represents a promising solution for advanced CMOS technologies.
AB - We have demonstrated a thermally managed Si nanopillar/SiGe composite structure. Our fabricated defect-free Si nanopillar channel structure showed a 1/100 times lower thermal conductivity than Si bulk thanks to the control of the phonon transports. The results of thermal conductivity measurements clarified that the nanopillar structure could eliminate electron-phonon scattering. As such, this structure represents a promising solution for advanced CMOS technologies.
UR - http://www.scopus.com/inward/record.url?scp=85114960409&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85114960409&partnerID=8YFLogxK
U2 - 10.1109/NANO51122.2021.9514289
DO - 10.1109/NANO51122.2021.9514289
M3 - Conference contribution
AN - SCOPUS:85114960409
T3 - Proceedings of the IEEE Conference on Nanotechnology
SP - 199
EP - 202
BT - NANO 2021 - 21st IEEE International Conference on Nanotechnology, Proceedings
PB - IEEE Computer Society
T2 - 21st IEEE International Conference on Nanotechnology, NANO 2021
Y2 - 28 July 2021 through 30 July 2021
ER -