Shimatsu laboratory, FRIS/RIEC, Tohoku university

Research output: Contribution to journalComment/debatepeer-review

Original languageEnglish
Pages (from-to)425
Number of pages1
JournalJournal of Japan Institute of Electronics Packaging
Volume20
Issue number6
DOIs
Publication statusPublished - 2017 Sep

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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