Shielded-loop-type onchip magnetic-field probe to evaluate radiated emission from thin-film noise suppressor

Masahiro Yamaguchi; Shota Koya; Hideki Torizuka; Satoshi Aoyama; Shoji Kawahito

doi:10.1109/TMAG.2007.892998

Shielded-loop-type onchip magnetic-field probe to evaluate radiated emission from thin-film noise suppressor

Masahiro Yamaguchi, Shota Koya, Hideki Torizuka, Satoshi Aoyama, Shoji Kawahito

ENG - Electrical Engineering

Research output: Contribution to journal › Article › peer-review

20 Citations (Scopus)

Abstract

A silicon integrated RF magnetic field probe has been designed and microfabricated using CMOS-silicon-on-insulator (SOI) technology with a 0.15-μm design rule on a high-resistivity silicon substrate. The size of the coil window was 180 × 180 μm³. Coil and electrodes were separated by a 530-μm-long stripline so as to avoid stray voltage induction at the electrode portion. This probe was applied to evaluate the radiated emission from a thin-film electromagnetic noise suppressor. It was clarified and shown that the field intensity was suppressed by 4.0 dB at the center of the signal line at 1 GHz.

Original language	English
Pages (from-to)	2370-2372
Number of pages	3
Journal	IEEE Transactions on Magnetics
Volume	43
Issue number	6
DOIs	https://doi.org/10.1109/TMAG.2007.892998
Publication status	Published - 2007 Jun

Keywords

Amorphous magnetic films
Complementary metal-oxide semiconductor (CMOS) analog integrated circuits (ICs)
Electromagnetic radiative interference
Magnetic resonance
Magnetic-field measurement
Packaging

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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10.1109/TMAG.2007.892998

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title = "Shielded-loop-type onchip magnetic-field probe to evaluate radiated emission from thin-film noise suppressor",

abstract = "A silicon integrated RF magnetic field probe has been designed and microfabricated using CMOS-silicon-on-insulator (SOI) technology with a 0.15-μm design rule on a high-resistivity silicon substrate. The size of the coil window was 180 × 180 μm3. Coil and electrodes were separated by a 530-μm-long stripline so as to avoid stray voltage induction at the electrode portion. This probe was applied to evaluate the radiated emission from a thin-film electromagnetic noise suppressor. It was clarified and shown that the field intensity was suppressed by 4.0 dB at the center of the signal line at 1 GHz.",

keywords = "Amorphous magnetic films, Complementary metal-oxide semiconductor (CMOS) analog integrated circuits (ICs), Electromagnetic radiative interference, Magnetic resonance, Magnetic-field measurement, Packaging",

author = "Masahiro Yamaguchi and Shota Koya and Hideki Torizuka and Satoshi Aoyama and Shoji Kawahito",

note = "Funding Information: ACKNOWLEDGMENT The authors would like to thank METZ2 project members Dr. N. Masuda (NEC Co.) for valuable discussions and comments; M. Okazaki and H. Eifuku (Panasonic Factory Solutions Co.), and S. Kawamoto (Namics Co.) for their help on packaging; and students T. Fukushima, T. Yasui, and A. Ito for their help. The chip fabrication program of VDEC, the University of Tokyo, in collaboration with Oki Electric Industry Co., was used. Jig fabrication was supported by the Machine Shop, Department of Electrical and Computer Engineering (M. Kobayashi) and Innovation Plaza of Tohoku University. This work was supported in part by the Ministry of Internal Affairs and Communications (SCOPE) and the Nationwide Cooperative Research Projects (Res. Inst. Elec. Comm., Tohoku University).",

year = "2007",

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doi = "10.1109/TMAG.2007.892998",

language = "English",

volume = "43",

pages = "2370--2372",

journal = "IEEE Transactions on Magnetics",

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AU - Yamaguchi, Masahiro

AU - Koya, Shota

AU - Torizuka, Hideki

AU - Aoyama, Satoshi

AU - Kawahito, Shoji

N1 - Funding Information: ACKNOWLEDGMENT The authors would like to thank METZ2 project members Dr. N. Masuda (NEC Co.) for valuable discussions and comments; M. Okazaki and H. Eifuku (Panasonic Factory Solutions Co.), and S. Kawamoto (Namics Co.) for their help on packaging; and students T. Fukushima, T. Yasui, and A. Ito for their help. The chip fabrication program of VDEC, the University of Tokyo, in collaboration with Oki Electric Industry Co., was used. Jig fabrication was supported by the Machine Shop, Department of Electrical and Computer Engineering (M. Kobayashi) and Innovation Plaza of Tohoku University. This work was supported in part by the Ministry of Internal Affairs and Communications (SCOPE) and the Nationwide Cooperative Research Projects (Res. Inst. Elec. Comm., Tohoku University).

PY - 2007/6

Y1 - 2007/6

N2 - A silicon integrated RF magnetic field probe has been designed and microfabricated using CMOS-silicon-on-insulator (SOI) technology with a 0.15-μm design rule on a high-resistivity silicon substrate. The size of the coil window was 180 × 180 μm3. Coil and electrodes were separated by a 530-μm-long stripline so as to avoid stray voltage induction at the electrode portion. This probe was applied to evaluate the radiated emission from a thin-film electromagnetic noise suppressor. It was clarified and shown that the field intensity was suppressed by 4.0 dB at the center of the signal line at 1 GHz.

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KW - Amorphous magnetic films

KW - Complementary metal-oxide semiconductor (CMOS) analog integrated circuits (ICs)

KW - Electromagnetic radiative interference

KW - Magnetic resonance

KW - Magnetic-field measurement

KW - Packaging

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Shielded-loop-type onchip magnetic-field probe to evaluate radiated emission from thin-film noise suppressor

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