Shear strength of room-temperature-bonded sapphire and metal substrates using Au films

H. Kon, M. Uomoto, N. Nakajima, T. Nakaya, T. Shimatsu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

For sapphire and various metals (Al alloys, Cu alloys, and stainless steel) bonded at room temperature using Au films, shear strength was assessed in this study. Results show extremely high shear strength of all samples: Greater than 10 kN (50 MPa).

Original languageEnglish
Title of host publicationProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages1
ISBN (Electronic)9784904743034
DOIs
Publication statusPublished - 2017 Jun 13
Event5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan
Duration: 2017 May 162017 May 18

Publication series

NameProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017

Other

Other5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
CountryJapan
CityTokyo
Period17/5/1617/5/18

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films

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