Abstract
We show that by making full use of the features of electrochemical etching in InAlAs/InGaAs heterostructures, deep gate grooves with small side etching can be fabricated. The most important advantage of this technology is that the vertical etching in the small gate openings will be remarkably enhanced by a self-organized process. Therefore the electrochemical etching provides a what we call "self-compensation" of the short channel effects. The effectiveness of this technology is evidenced by the excellent performance combined with the alleviation of the threshold-voltage shift and suppression of transconductance degradation in MODFET's with gate lengths below 0.1 μm.
Original language | English |
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Pages (from-to) | 484-486 |
Number of pages | 3 |
Journal | IEEE Electron Device Letters |
Volume | 19 |
Issue number | 12 |
DOIs | |
Publication status | Published - 1998 Dec 1 |
Externally published | Yes |
Keywords
- Electrochemical processes
- Etching
- MODFET's
- Millimeter-wave FET's
- Semiconductor device fabrication
- Semiconductor heterojunction
- Submillimeter-wave FET's
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering