TY - GEN
T1 - Self-assembly technology for reconfigured wafer-to-wafer 3D integration
AU - Fukushima, T.
AU - Iwata, E.
AU - Lee, K. W.
AU - Tanaka, T.
AU - Koyanagi, M.
PY - 2010/8/9
Y1 - 2010/8/9
N2 - We have introduced a new 3D stacking technology called reconfigured wafer-to-wafer 3D integration using surface tension-powered multichip self-assembly and multichip transfer techniques. Many Si chips were simultaneously selfassembled to a carrier wafer named "reconfigured wafer". High-precision chip alignment with sub-micron-scale accuracy can be realized by optimizing self-assembly conditions. In addition, we developed a new self-assembled multichip bonder to three-dimensionally stack many known good dies (KDGs) on 8-inch wafers at the wafer level. By using the equipment, the many self-assembled Si chips were transferred to another target wafer in batch.
AB - We have introduced a new 3D stacking technology called reconfigured wafer-to-wafer 3D integration using surface tension-powered multichip self-assembly and multichip transfer techniques. Many Si chips were simultaneously selfassembled to a carrier wafer named "reconfigured wafer". High-precision chip alignment with sub-micron-scale accuracy can be realized by optimizing self-assembly conditions. In addition, we developed a new self-assembled multichip bonder to three-dimensionally stack many known good dies (KDGs) on 8-inch wafers at the wafer level. By using the equipment, the many self-assembled Si chips were transferred to another target wafer in batch.
UR - http://www.scopus.com/inward/record.url?scp=77955213070&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77955213070&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2010.5490830
DO - 10.1109/ECTC.2010.5490830
M3 - Conference contribution
AN - SCOPUS:77955213070
SN - 9781424464104
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1050
EP - 1055
BT - 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010
T2 - 60th Electronic Components and Technology Conference, ECTC 2010
Y2 - 1 June 2010 through 4 June 2010
ER -