Self-assembly technologies with high-precision chip alignment and fine-pitch microbump bonding for advanced die-to-wafer 3D integration

Takafumi Fukushima, Y. Ohara, M. Murugesan, Jichoru Be, Kanuku Ri, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

21 Citations (Scopus)

Abstract

We have demonstrated surface-tension-driven chip selfassembly for 3D stacking of a large number of known good dies (KGDs) on silicon substrates in batch processing. In this work, we employed small droplets of ultra-pure water as a liquid to precisely align chips having fine-pitch indium/gold microbumps with a size/pitch of 5/10 or 10/20 μm. By using the self-assembly technique, these chips were aligned in a face-down configuration and flip-chip bonded onto hydrophilic bonding areas formed on silicon substrates. The hydrophilic areas are surrounded by hydrophobic areas that have above 100° in water contact angle. The wettability contrast between the hydrophilic and hydrophobic areas was found to be a key parameter to obtain high alignment accuracy. All chips having the indium/gold microbump arrays were self-assembled with high alignment accuracy of approximately 1 μm or superior accuracy, and then, successfully bonded at 200 °C with thermal compression. The resulting resistance measured with the indium/gold daisy chain patterns was sufficiently low (< 20 mΩ/bump) and comparable to one obtained by a conventional mechanical alignment technique.

Original languageEnglish
Title of host publication2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011
Pages2050-2055
Number of pages6
DOIs
Publication statusPublished - 2011 Jul 21
Event2011 61st Electronic Components and Technology Conference, ECTC 2011 - Lake Buena Vista, FL, United States
Duration: 2011 May 312011 Jun 3

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other2011 61st Electronic Components and Technology Conference, ECTC 2011
CountryUnited States
CityLake Buena Vista, FL
Period11/5/3111/6/3

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Fukushima, T., Ohara, Y., Murugesan, M., Be, J., Ri, K., Tanaka, T., & Koyanagi, M. (2011). Self-assembly technologies with high-precision chip alignment and fine-pitch microbump bonding for advanced die-to-wafer 3D integration. In 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011 (pp. 2050-2055). [5898799] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2011.5898799