TY - GEN
T1 - Self-assembly technologies for FlexTrate™
AU - Fukushima, Takafumi
AU - Susumago, Yuki
AU - Kino, Hisashi
AU - Tanaka, Tetsu
AU - Alam, Arsalan
AU - Hanna, Amir
AU - Iyer, Subramanian S.
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/8/7
Y1 - 2018/8/7
N2 - We have developed new flexible hybrid electronics (FHE) systems called FlexTrateTM that is high-performance and scalable flexible substrates embedding heterogeneous inorganic monocrystalline semiconductor dielets. In this work, a modified die-first FOWLP technology with surface tension-driven multichip self-assembly is used for the fabrication of FlexTrateTM. The detailed self-assembly for the FlexTrateTM application is described to precisely and highly integrate heterogeneous dielets embedded in PDMS as a flexible substrate in wafer-level processing.
AB - We have developed new flexible hybrid electronics (FHE) systems called FlexTrateTM that is high-performance and scalable flexible substrates embedding heterogeneous inorganic monocrystalline semiconductor dielets. In this work, a modified die-first FOWLP technology with surface tension-driven multichip self-assembly is used for the fabrication of FlexTrateTM. The detailed self-assembly for the FlexTrateTM application is described to precisely and highly integrate heterogeneous dielets embedded in PDMS as a flexible substrate in wafer-level processing.
KW - Capillary Self-Assembly
KW - FOWLP
KW - Flexible Hybrid Electronics (FHE)
KW - Heterogeneous Integration
KW - PDMS
UR - http://www.scopus.com/inward/record.url?scp=85051973701&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85051973701&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2018.00275
DO - 10.1109/ECTC.2018.00275
M3 - Conference contribution
AN - SCOPUS:85051973701
SN - 9781538649985
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1836
EP - 1841
BT - Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 68th IEEE Electronic Components and Technology Conference, ECTC 2018
Y2 - 29 May 2018 through 1 June 2018
ER -