Self-assembly technologies for FlexTrate™

Takafumi Fukushima; Yuki Susumago; Hisashi Kino; Tetsu Tanaka; Arsalan Alam; Amir Hanna; Subramanian S. Iyer

doi:10.1109/ECTC.2018.00275

Self-assembly technologies for FlexTrate™

Takafumi Fukushima, Yuki Susumago, Hisashi Kino, Tetsu Tanaka, Arsalan Alam, Amir Hanna, Subramanian S. Iyer

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

We have developed new flexible hybrid electronics (FHE) systems called FlexTrateTM that is high-performance and scalable flexible substrates embedding heterogeneous inorganic monocrystalline semiconductor dielets. In this work, a modified die-first FOWLP technology with surface tension-driven multichip self-assembly is used for the fabrication of FlexTrateTM. The detailed self-assembly for the FlexTrateTM application is described to precisely and highly integrate heterogeneous dielets embedded in PDMS as a flexible substrate in wafer-level processing.

Original language	English
Title of host publication	Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1836-1841
Number of pages	6
ISBN (Print)	9781538649985
DOIs	https://doi.org/10.1109/ECTC.2018.00275
Publication status	Published - 2018 Aug 7
Event	68th IEEE Electronic Components and Technology Conference, ECTC 2018 - San Diego, United States Duration: 2018 May 29 → 2018 Jun 1

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Volume	2018-May
ISSN (Print)	0569-5503

Other

Other	68th IEEE Electronic Components and Technology Conference, ECTC 2018
Country	United States
City	San Diego
Period	18/5/29 → 18/6/1

Keywords

Capillary Self-Assembly
FOWLP
Flexible Hybrid Electronics (FHE)
Heterogeneous Integration
PDMS

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2018.00275

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Cite this

Fukushima, T., Susumago, Y., Kino, H., Tanaka, T., Alam, A., Hanna, A., & Iyer, S. S. (2018). Self-assembly technologies for FlexTrate™. In Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018 (pp. 1836-1841). [8429788] (Proceedings - Electronic Components and Technology Conference; Vol. 2018-May). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2018.00275

Self-assembly technologies for FlexTrate™. / Fukushima, Takafumi; Susumago, Yuki; Kino, Hisashi ; Tanaka, Tetsu; Alam, Arsalan; Hanna, Amir; Iyer, Subramanian S.

Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1836-1841 8429788 (Proceedings - Electronic Components and Technology Conference; Vol. 2018-May).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Fukushima, T, Susumago, Y, Kino, H , Tanaka, T, Alam, A, Hanna, A & Iyer, SS 2018, Self-assembly technologies for FlexTrate™. in Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018., 8429788, Proceedings - Electronic Components and Technology Conference, vol. 2018-May, Institute of Electrical and Electronics Engineers Inc., pp. 1836-1841, 68th IEEE Electronic Components and Technology Conference, ECTC 2018, San Diego, United States, 18/5/29. https://doi.org/10.1109/ECTC.2018.00275

Fukushima T, Susumago Y, Kino H , Tanaka T, Alam A, Hanna A et al. Self-assembly technologies for FlexTrate™. In Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc. 2018. p. 1836-1841. 8429788. (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2018.00275

Fukushima, Takafumi ; Susumago, Yuki ; Kino, Hisashi ; Tanaka, Tetsu ; Alam, Arsalan ; Hanna, Amir ; Iyer, Subramanian S. / Self-assembly technologies for FlexTrate™. Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 1836-1841 (Proceedings - Electronic Components and Technology Conference).

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