TY - GEN
T1 - Self-assembly process for chip-to-wafer three-dimensional integration
AU - Fukushima, T.
AU - Yamada, Y.
AU - Kikuchi, H.
AU - Tanaka, T.
AU - Koyanagi, M.
PY - 2007
Y1 - 2007
N2 - We have proposed chip-to-wafer stacking for three-dimensional (3D) integration. To realize the chip-to-wafer 3D integration, five key technologies of through-Si interconnection and microbump formation, chip-to-wafer alignment, underfilling, and chip thinning were investigated. Three-layer stacked chips with a layer thickness of several tens microns were fabricated by using the key technologies. Each chip was serially and mechanically aligned and bonded onto a support LSI wafer. In addition, we newly introduce a stacking technique using self-assembly as a key process for advanced chip-to-wafer 3D integration. High-precision alignment with an accuracy of within 1 μm was obtained and stacking throughput can be dramatically improved by the self-assembly.
AB - We have proposed chip-to-wafer stacking for three-dimensional (3D) integration. To realize the chip-to-wafer 3D integration, five key technologies of through-Si interconnection and microbump formation, chip-to-wafer alignment, underfilling, and chip thinning were investigated. Three-layer stacked chips with a layer thickness of several tens microns were fabricated by using the key technologies. Each chip was serially and mechanically aligned and bonded onto a support LSI wafer. In addition, we newly introduce a stacking technique using self-assembly as a key process for advanced chip-to-wafer 3D integration. High-precision alignment with an accuracy of within 1 μm was obtained and stacking throughput can be dramatically improved by the self-assembly.
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U2 - 10.1109/ECTC.2007.373895
DO - 10.1109/ECTC.2007.373895
M3 - Conference contribution
AN - SCOPUS:35348855658
SN - 1424409853
SN - 9781424409853
T3 - Proceedings - Electronic Components and Technology Conference
SP - 836
EP - 841
BT - Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
T2 - 57th Electronic Components and Technology Conference 2007, ECTC '07
Y2 - 29 May 2007 through 1 June 2007
ER -