Self-assembly based multichip-to-wafer bonding technologies for 3D/hetero integration

T. Fukushima, K. W. Lee, T. Tanaka, M. Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fingerprint Dive into the research topics of 'Self-assembly based multichip-to-wafer bonding technologies for 3D/hetero integration'. Together they form a unique fingerprint.

Engineering & Materials Science