Self-assembly based multichip-to-wafer bonding technologies for 3D/hetero integration

T. Fukushima, K. W. Lee, T. Tanaka, M. Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We have proposed and developed 3D integration technologies based on self-assembly using surface tension of liquid in this decade. In this paper, microbump bonding and bumpless bonding in face-up and/or face-down configuration are introduced for finepitch interconnect formation. In addition, "non-transfer stacking", in other word, flip-chip self-assembly and "transfer stacking" called reconfigure-wafer-to-wafer using SAE carrier are explained.

Original languageEnglish
Title of host publicationSemiconductor Wafer Bonding
Subtitle of host publicationScience, Technology and Applications 14
EditorsR. Knechtel, F. Fournel, K. D. Hobart, T. Suga, H. Baumgart, C. S. Tan, M. S. Goorsky
PublisherElectrochemical Society Inc.
Pages285-290
Number of pages6
Edition9
ISBN (Electronic)9781607685395
DOIs
Publication statusPublished - 2016 Jan 1
EventSymposium on Semiconductor Wafer Bonding: Science, Technology and Applications 14 - PRiME 2016/230th ECS Meeting - Honolulu, United States
Duration: 2016 Oct 22016 Oct 7

Publication series

NameECS Transactions
Number9
Volume75
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Other

OtherSymposium on Semiconductor Wafer Bonding: Science, Technology and Applications 14 - PRiME 2016/230th ECS Meeting
CountryUnited States
CityHonolulu
Period16/10/216/10/7

ASJC Scopus subject areas

  • Engineering(all)

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