Self-Assembly Based 3D and Heterointegration

Research output: Chapter in Book/Report/Conference proceedingChapter

1 Citation (Scopus)

Abstract

In order to improve assembly throughput and production yield in chip-on-wafer 3D integration, surface tension-driven chip self-assembly technologies have been proposed. Small volume of liquid droplets can precisely assemble a large number of known good dies on host wafers at the sub-micrometer accuracy level. Here, impact of several parameters on alignment accuracies are described. In addition, this chapter introduces interconnect technologies of self-assembled chips in a face-up or face-down bonding fashion to the host wafers with metal microbumps.

Original languageEnglish
Title of host publication3D Process Technology
PublisherWiley-Blackwell
Pages325-334
Number of pages10
Volume3
ISBN (Electronic)9783527670109
ISBN (Print)9783527334667
DOIs
Publication statusPublished - 2014 Jul 21

Keywords

  • 3D chip stacking
  • 3D hetero integration
  • Alignment accuracies
  • Flip-chip bonding
  • Microbumps
  • Self-assembly

ASJC Scopus subject areas

  • Engineering(all)
  • Biochemistry, Genetics and Molecular Biology(all)
  • Chemical Engineering(all)
  • Materials Science(all)

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