Selective surface-modification in main-chain polymer-metal complex nanocrystals

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publication22nd International Congress of Chemical and Process Engineering, CHISA 2016 and 19th Conference on Process Integration, Modelling and Optimisation for Energy Saving and Pollution Reduction, PRES 2016
PublisherCzech Society of Chemical Engineering
Pages564-565
Number of pages2
ISBN (Electronic)9781510859623
Publication statusPublished - 2016 Jan 1
Event22nd International Congress of Chemical and Process Engineering, CHISA 2016 and 19th Conference on Process Integration, Modelling and Optimisation for Energy Saving and Pollution Reduction, PRES 2016 - Prague, Czech Republic
Duration: 2016 Aug 272016 Aug 31

Publication series

Name22nd International Congress of Chemical and Process Engineering, CHISA 2016 and 19th Conference on Process Integration, Modelling and Optimisation for Energy Saving and Pollution Reduction, PRES 2016
Volume1

Other

Other22nd International Congress of Chemical and Process Engineering, CHISA 2016 and 19th Conference on Process Integration, Modelling and Optimisation for Energy Saving and Pollution Reduction, PRES 2016
CountryCzech Republic
CityPrague
Period16/8/2716/8/31

ASJC Scopus subject areas

  • Process Chemistry and Technology
  • Chemical Engineering (miscellaneous)

Cite this

Suzuki, R., Onodera, T., Kasai, H., & Oikawa, H. (2016). Selective surface-modification in main-chain polymer-metal complex nanocrystals. In 22nd International Congress of Chemical and Process Engineering, CHISA 2016 and 19th Conference on Process Integration, Modelling and Optimisation for Energy Saving and Pollution Reduction, PRES 2016 (pp. 564-565). (22nd International Congress of Chemical and Process Engineering, CHISA 2016 and 19th Conference on Process Integration, Modelling and Optimisation for Energy Saving and Pollution Reduction, PRES 2016; Vol. 1). Czech Society of Chemical Engineering.