TY - GEN
T1 - Selective metallization based on laser direct writing and additive metallization process
AU - Watanabe, Akira
AU - Cai, Jinguang
N1 - Funding Information:
This work was supported by JSPS KAKENHI Grant Number JP24102004, JSPS KAKENHI Grant Number JP24102004, Matching Planner Program from Japan Science and Technology Agency, JST (MP27115662986), National Natural Science Foundation of China (No. 21603201), and China Academy of Engineering Physics (item no. TP201302-3).
Publisher Copyright:
© 2017 SPIE.
Copyright:
Copyright 2017 Elsevier B.V., All rights reserved.
PY - 2017
Y1 - 2017
N2 - The selective metallization on a flexible polymer film via laser direct writing and the following additive metallization process was studied as an alternate to conventional semi-additive process in the fabrication of printed circuit board. A Cu micropattern was fabricated on a polyimide film via CW blue-violet laser direct writing using a Cu nanoparticle ink and applied to a seed layer for the Cu electroplating. The on-demand processing of a Cu micropattern whose line width and thickness are ca. 5 and 2 μm, respectively, was achieved by combination of a laser-written seed micropattern and the following electro-plating. The homogeneity of the Cu micropatterns prepared from Cu nanoparticles was easily improved by combination with the following Cu plating.
AB - The selective metallization on a flexible polymer film via laser direct writing and the following additive metallization process was studied as an alternate to conventional semi-additive process in the fabrication of printed circuit board. A Cu micropattern was fabricated on a polyimide film via CW blue-violet laser direct writing using a Cu nanoparticle ink and applied to a seed layer for the Cu electroplating. The on-demand processing of a Cu micropattern whose line width and thickness are ca. 5 and 2 μm, respectively, was achieved by combination of a laser-written seed micropattern and the following electro-plating. The homogeneity of the Cu micropatterns prepared from Cu nanoparticles was easily improved by combination with the following Cu plating.
KW - Cu electroplating
KW - Cu interconnection
KW - additive metallization process
KW - copper micropattern
KW - copper nanoparticle ink
KW - flexible and printed electronics
KW - laser direct writing
KW - selective metallization
UR - http://www.scopus.com/inward/record.url?scp=85019459035&partnerID=8YFLogxK
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U2 - 10.1117/12.2251167
DO - 10.1117/12.2251167
M3 - Conference contribution
AN - SCOPUS:85019459035
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Laser-Based Micro- and Nanoprocessing XI
A2 - Klotzbach, Udo
A2 - Kling, Rainer
A2 - Washio, Kunihiko
PB - SPIE
T2 - Laser-Based Micro- and Nanoprocessing XI 2017
Y2 - 31 January 2017 through 2 February 2017
ER -