Selective metallization based on laser direct writing and additive metallization process

Akira Watanabe, Jinguang Cai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)


The selective metallization on a flexible polymer film via laser direct writing and the following additive metallization process was studied as an alternate to conventional semi-additive process in the fabrication of printed circuit board. A Cu micropattern was fabricated on a polyimide film via CW blue-violet laser direct writing using a Cu nanoparticle ink and applied to a seed layer for the Cu electroplating. The on-demand processing of a Cu micropattern whose line width and thickness are ca. 5 and 2 μm, respectively, was achieved by combination of a laser-written seed micropattern and the following electro-plating. The homogeneity of the Cu micropatterns prepared from Cu nanoparticles was easily improved by combination with the following Cu plating.

Original languageEnglish
Title of host publicationLaser-Based Micro- and Nanoprocessing XI
EditorsUdo Klotzbach, Rainer Kling, Kunihiko Washio
ISBN (Electronic)9781510606258
Publication statusPublished - 2017
EventLaser-Based Micro- and Nanoprocessing XI 2017 - San Francisco, United States
Duration: 2017 Jan 312017 Feb 2

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X


OtherLaser-Based Micro- and Nanoprocessing XI 2017
CountryUnited States
CitySan Francisco


  • Cu electroplating
  • Cu interconnection
  • additive metallization process
  • copper micropattern
  • copper nanoparticle ink
  • flexible and printed electronics
  • laser direct writing
  • selective metallization

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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