Selective metallization based on laser direct writing and additive metallization process

Akira Watanabe, Jinguang Cai

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)

    Abstract

    The selective metallization on a flexible polymer film via laser direct writing and the following additive metallization process was studied as an alternate to conventional semi-additive process in the fabrication of printed circuit board. A Cu micropattern was fabricated on a polyimide film via CW blue-violet laser direct writing using a Cu nanoparticle ink and applied to a seed layer for the Cu electroplating. The on-demand processing of a Cu micropattern whose line width and thickness are ca. 5 and 2 μm, respectively, was achieved by combination of a laser-written seed micropattern and the following electro-plating. The homogeneity of the Cu micropatterns prepared from Cu nanoparticles was easily improved by combination with the following Cu plating.

    Original languageEnglish
    Title of host publicationLaser-Based Micro- and Nanoprocessing XI
    EditorsUdo Klotzbach, Rainer Kling, Kunihiko Washio
    PublisherSPIE
    ISBN (Electronic)9781510606258
    DOIs
    Publication statusPublished - 2017
    EventLaser-Based Micro- and Nanoprocessing XI 2017 - San Francisco, United States
    Duration: 2017 Jan 312017 Feb 2

    Publication series

    NameProceedings of SPIE - The International Society for Optical Engineering
    Volume10092
    ISSN (Print)0277-786X
    ISSN (Electronic)1996-756X

    Other

    OtherLaser-Based Micro- and Nanoprocessing XI 2017
    Country/TerritoryUnited States
    CitySan Francisco
    Period17/1/3117/2/2

    Keywords

    • Cu electroplating
    • Cu interconnection
    • additive metallization process
    • copper micropattern
    • copper nanoparticle ink
    • flexible and printed electronics
    • laser direct writing
    • selective metallization

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Computer Science Applications
    • Applied Mathematics
    • Electrical and Electronic Engineering

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