SAW substrate with coupling factor and excellent temperature stability suitable for duplexer of PCS in US

Michio Kadota, Takeshi Nakao, Norio Taniguchi, Eiichi Takata, Masakazu Mimura, Kenji Nishiyama, Takuo Hada, Tomohisa Komura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

31 Citations (Scopus)

Abstract

The pass-bands of a transmission (Tx) and a receiving (Rx) of the Personal Communication Services, (PCS) handy phone in US are 1850-1910 MHz and 1930-1990 MHz, respectively. The transition bandwidth between the Tx and the Rx is very narrow as 20 MHz compared with other systems. A duplexer for the PCS using surface acoustic wave (SAW) requires a SAW substrate, which has a the good temperature stability, an optimum electromechanical coupling factor, and a large reflection coefficient. Some of Rayleigh waves and leaky SAWs (LSAWs) on various substrate or structures have a good temperature characteristic, but almost all of them have not a optimum coupling factor and a large reflection coefficient for the US-PCS duplexer. In 2003, authors reported the US-PCS SAW duplexer having good temperature stability, a steep frequency characteristic in transition band, a low loss, and a large out-of band suppression [1]. This paper describes the detail of the new substrate having the good temperature stability, the optimum electromechanical coupling factor, and the sufficient reflection coefficient.

Original languageEnglish
Title of host publicationProceedings - 2004 IEEE Ultrasonics Symposium
Subtitle of host publicationA Conference of the IEEE International Ultrasonics, Ferroelectrics, and Frequency Control Society, UFFC-S
EditorsM.P. Yuhas
Pages1970-1975
Number of pages6
DOIs
Publication statusPublished - 2004 Dec 1
Event2004 IEEE Ultrasonics Symposium - Montreal, Que., Canada
Duration: 2004 Aug 232004 Aug 27

Publication series

NameProceedings - IEEE Ultrasonics Symposium
Volume3
ISSN (Print)1051-0117

Other

Other2004 IEEE Ultrasonics Symposium
Country/TerritoryCanada
CityMontreal, Que.
Period04/8/2304/8/27

ASJC Scopus subject areas

  • Acoustics and Ultrasonics

Fingerprint

Dive into the research topics of 'SAW substrate with coupling factor and excellent temperature stability suitable for duplexer of PCS in US'. Together they form a unique fingerprint.

Cite this