Abstract
Authors previously proposed a SAW PCS-duplexer with an excellent temperature coefficient of frequency (TCP) and a good frequency characteristic composed of a thick-SiO2/thin-Au-electrodes /LiIaO3 structure. However, a sheet resistance of thin Au electrode is large, compared with thick Al-electrode, so thin Au-electrode is not suitable for filters requiring low loss. Authors tried to use thick Cu electrodes with small resistance By flattening large convex portions on the SiO2 surface, a SAW substrate suitable for US-PCS duplexer with low insertion loss and an excellent TCF was realized.
Original language | English |
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Article number | 4014910 |
Pages (from-to) | 382-385 |
Number of pages | 4 |
Journal | IEEE MTT-S International Microwave Symposium Digest |
DOIs | |
Publication status | Published - 2006 Dec 1 |
Event | 2006 IEEE MTT-S International Microwave Symposium Digest - San Francisco, CA, United States Duration: 2006 Jun 11 → 2006 Jun 16 |
Keywords
- Cu electrode
- Duplexer
- Excellent TCF
- Flattened SiO2
- LiTaO3
ASJC Scopus subject areas
- Radiation
- Condensed Matter Physics
- Electrical and Electronic Engineering