Room temperature vacuum sealing using surfaced activated bonding with Au thin films

Hironao Okada, Toshihiro Itoh, Jörg Frömel, Thomas Gessner, Tadatomo Suga

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)

Abstract

We report the surface activated bonding (SAB) through Au thin films with the thickness of a few tens of nanometers can be applied to room temperature vacuum sealing for microelectromechanical systems (MEMS) packaging. In previous study, it was found that room temperature bonding of Si/Si and Si/chemical mechanical polished (CMP) electroplated Cu could be successfully applied to vacuum sealing of micro cavities. However this method needs high vacuum in bonding process for keeping activated surfaces and the surfaces should be cleaned by wet processes. In this study we attempt to realize room temperature vacuum sealing in low vacuum without any wet surface pre-treatments utilizing Au thin films with controlled surface roughness. We propose and develop packaging structures with comb-drive resonators for characterization of sealing quality and show the applicability of SAB of Au-Au thin films to vacuum-seal packaging.

Original languageEnglish
Title of host publicationTRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers
Pages932-935
Number of pages4
DOIs
Publication statusPublished - 2005 Nov 9
Externally publishedYes
Event13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05 - Seoul, Korea, Republic of
Duration: 2005 Jun 52005 Jun 9

Publication series

NameDigest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05
Volume1

Other

Other13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05
CountryKorea, Republic of
CitySeoul
Period05/6/505/6/9

Keywords

  • Au thin film
  • Comb-drive resonator
  • Microelectromechanical systems (MEMS)
  • Surface activated bonding (SAB)
  • Vacuum sealing

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Okada, H., Itoh, T., Frömel, J., Gessner, T., & Suga, T. (2005). Room temperature vacuum sealing using surfaced activated bonding with Au thin films. In TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers (pp. 932-935). [2E4.120] (Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05; Vol. 1). https://doi.org/10.1109/SENSOR.2005.1496571