Room temperature bonding of wafers with thin nanocrystalline metal films and its application to devices fabrication

Takehito Shimatsu, Miyuki Uomoto

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)
Original languageEnglish
Pages (from-to)710-713
Number of pages4
JournalSeimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Volume79
Issue number8
DOIs
Publication statusPublished - 2013 Aug

Keywords

  • Atomic diffusion bonding
  • Atomic diffusion coefficient
  • Bonding energy
  • Iroom temperature bonding
  • Metal films
  • Nanocrystalline
  • Recrystallization
  • Surface energy
  • Surface roughness

ASJC Scopus subject areas

  • Mechanical Engineering

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