@article{31026cf3fb6e490fa7b89b6d2e09f9f5,
title = "Room temperature bonding of wafers with thin nanocrystalline metal films and its application to devices fabrication",
keywords = "Atomic diffusion bonding, Atomic diffusion coefficient, Bonding energy, Iroom temperature bonding, Metal films, Nanocrystalline, Recrystallization, Surface energy, Surface roughness",
author = "Takehito Shimatsu and Miyuki Uomoto",
year = "2013",
month = aug,
doi = "10.2493/jjspe.79.710",
language = "English",
volume = "79",
pages = "710--713",
journal = "Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering",
issn = "0912-0289",
publisher = "Japan Society for Precision Engineering",
number = "8",
}