TY - GEN
T1 - Room-temperature bonding of AlN ceramic and Si semiconductor substrates for improved thermal management
AU - Matsumae, Takashi
AU - Kurashima, Yuichi
AU - Takagi, Hideki
AU - Nishizono, Kazunori
AU - Amano, Tsutomu
AU - Higurashi, Eiji
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/5/12
Y1 - 2021/5/12
N2 - An AlN ceramic substrate was bonded with a Si substrate by using a surface activated bonding method for advanced thermal management. When the sputtered surfaces were directly bonded, the bonding strength was ~1 J/m2. However, when the bonding process was modified to provide a Si adhesion layer with a thickness of 1.5 nm on the AlN surface, the adhesion strength become equivalent to 2.5 J/m2. As a device substrate can be integrated on the heat dissipation broad consisting of AlN through atomically thin bonding layer, the proposed bonding technique would facilitate efficient cooling system for future high power electronic devices.
AB - An AlN ceramic substrate was bonded with a Si substrate by using a surface activated bonding method for advanced thermal management. When the sputtered surfaces were directly bonded, the bonding strength was ~1 J/m2. However, when the bonding process was modified to provide a Si adhesion layer with a thickness of 1.5 nm on the AlN surface, the adhesion strength become equivalent to 2.5 J/m2. As a device substrate can be integrated on the heat dissipation broad consisting of AlN through atomically thin bonding layer, the proposed bonding technique would facilitate efficient cooling system for future high power electronic devices.
KW - AlN ceramic
KW - Heat spreader
KW - Surface activated bonding
KW - Thermal management
UR - http://www.scopus.com/inward/record.url?scp=85113300739&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85113300739&partnerID=8YFLogxK
U2 - 10.23919/ICEP51988.2021.9451969
DO - 10.23919/ICEP51988.2021.9451969
M3 - Conference contribution
AN - SCOPUS:85113300739
T3 - 2021 International Conference on Electronics Packaging, ICEP 2021
SP - 65
EP - 66
BT - 2021 International Conference on Electronics Packaging, ICEP 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th International Conference on Electronics Packaging, ICEP 2021
Y2 - 12 May 2021 through 14 May 2021
ER -