Abstract
The role of an ultra thin SiOx layer for epitaxial growth of a YSZ (Y 2O3 stabilized ZrO2) thin film on a (001)Si substrate through the SiOx layer was investigated by high resolution transmission electron microscope (HRTEM), in-situ heating transmission electron microscope and nano-beam diffraction (NBD) methods. It is found that a trace of epitaxial crystallinity remains in an ultra thin SiOx layer within 2 nm from SiOx/Si interface. According to this result, a YSZ layer could epitaxially grow only on an ultra thin 1-2 nm SiOx layer. It is also found that an ultra thin SiOx layer has another effect to relax the crystallization strain at a YSZ/Si interface. These results indicate that an ultra thin SiOx layer plays two important roles: (a) an ultra thin SiOx layer formed just above the Si surface serves as a medium for the epitaxial growth of a YSZ layer, and (b) even in an ultra thin SiOx is able to relax the crystallization strain of YSZ layer at YSZ/Si interface. These are the critical points of the epitaxial growth of YSZ/SiOx/(001)Si thin film together with a role of an oxygen source reported previously.
Original language | English |
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Pages (from-to) | 51-61 |
Number of pages | 11 |
Journal | Integrated Ferroelectrics |
Volume | 51 |
DOIs | |
Publication status | Published - 2003 |
Externally published | Yes |
Keywords
- Epitaxy
- HRTEM
- High-k gate dielectrics
- In-situ TEM
- PLD
- Si
- SiOx
- Strain relaxation
- YSZ
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Control and Systems Engineering
- Ceramics and Composites
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry