Role of Al2O3 layer in oxidation resistance of Cu-Al dilute alloys pre-annealed in H2 atmospheres

Sang Hwui Hong; Yongfu Zhu; Kouji Mimura; Minoru Isshiki

doi:10.1016/j.corsci.2006.02.009

Role of Al₂O₃ layer in oxidation resistance of Cu-Al dilute alloys pre-annealed in H₂ atmospheres

Sang Hwui Hong, Yongfu Zhu, Kouji Mimura, Minoru Isshiki

Division of Inorganic Material Research

Research output: Contribution to journal › Article › peer-review

6 Citations (Scopus)

Abstract

Copper was alloyed with small amounts of Al (0.2, 0.5, 1.0 and 2.0 mass%) to improve the oxidation resistance. Copper (6 N) and the Cu-Al alloys were oxidized at 773-1173 K in 0.1 MPa oxygen atmosphere after hydrogen annealing at 873 K. Continuous very thin Al₂O₃ layers were formed on the surface of all Cu-Al dilute alloys during the hydrogen annealing. Oxidation resistance of Cu-Al alloys was improved especially for Cu-2.0Al at 773-973 K, while it decreases on increasing the oxidation temperature. Cu-Al alloys followed the parabolic rate law at 1173 K, but most of other cases do not at and below 1073 K. Oxidation resistance for Cu-Al alloys was found relevant to the maintenance of the thin Al₂O₃ layer at the Cu₂O/Cu-Al alloy interface.

Original language	English
Pages (from-to)	3692-3702
Number of pages	11
Journal	Corrosion Science
Volume	48
Issue number	11
DOIs	https://doi.org/10.1016/j.corsci.2006.02.009
Publication status	Published - 2006 Nov

Keywords

Cu-Al alloy
Diffusion
Oxidation kinetic
Oxidation resistance
Secondary ion mass spectroscopy (SIMS)
Surface AlO layer

ASJC Scopus subject areas

Chemistry(all)
Chemical Engineering(all)
Materials Science(all)

Access to Document

10.1016/j.corsci.2006.02.009

Cite this

@article{40cc3007018d4df4a10db273ecc6fbd2,

title = "Role of Al2O3 layer in oxidation resistance of Cu-Al dilute alloys pre-annealed in H2 atmospheres",

abstract = "Copper was alloyed with small amounts of Al (0.2, 0.5, 1.0 and 2.0 mass%) to improve the oxidation resistance. Copper (6 N) and the Cu-Al alloys were oxidized at 773-1173 K in 0.1 MPa oxygen atmosphere after hydrogen annealing at 873 K. Continuous very thin Al2O3 layers were formed on the surface of all Cu-Al dilute alloys during the hydrogen annealing. Oxidation resistance of Cu-Al alloys was improved especially for Cu-2.0Al at 773-973 K, while it decreases on increasing the oxidation temperature. Cu-Al alloys followed the parabolic rate law at 1173 K, but most of other cases do not at and below 1073 K. Oxidation resistance for Cu-Al alloys was found relevant to the maintenance of the thin Al2O3 layer at the Cu2O/Cu-Al alloy interface.",

keywords = "Cu-Al alloy, Diffusion, Oxidation kinetic, Oxidation resistance, Secondary ion mass spectroscopy (SIMS), Surface AlO layer",

author = "Hong, {Sang Hwui} and Yongfu Zhu and Kouji Mimura and Minoru Isshiki",

note = "Funding Information: This work was done as a part of activities of Nanotechnology Metal Project under the auspices of the Japan Research and Development Center for Metals (JRCM) and the sponsorship of New Energy and Industrial Technology Development Organization (NEDO, Ministry of Economics, Trade and Industry).",

year = "2006",

month = nov,

doi = "10.1016/j.corsci.2006.02.009",

language = "English",

volume = "48",

pages = "3692--3702",

journal = "Corrosion Science",

issn = "0010-938X",

publisher = "Elsevier Limited",

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TY - JOUR

T1 - Role of Al2O3 layer in oxidation resistance of Cu-Al dilute alloys pre-annealed in H2 atmospheres

AU - Hong, Sang Hwui

AU - Zhu, Yongfu

AU - Mimura, Kouji

AU - Isshiki, Minoru

N1 - Funding Information: This work was done as a part of activities of Nanotechnology Metal Project under the auspices of the Japan Research and Development Center for Metals (JRCM) and the sponsorship of New Energy and Industrial Technology Development Organization (NEDO, Ministry of Economics, Trade and Industry).

PY - 2006/11

Y1 - 2006/11

N2 - Copper was alloyed with small amounts of Al (0.2, 0.5, 1.0 and 2.0 mass%) to improve the oxidation resistance. Copper (6 N) and the Cu-Al alloys were oxidized at 773-1173 K in 0.1 MPa oxygen atmosphere after hydrogen annealing at 873 K. Continuous very thin Al2O3 layers were formed on the surface of all Cu-Al dilute alloys during the hydrogen annealing. Oxidation resistance of Cu-Al alloys was improved especially for Cu-2.0Al at 773-973 K, while it decreases on increasing the oxidation temperature. Cu-Al alloys followed the parabolic rate law at 1173 K, but most of other cases do not at and below 1073 K. Oxidation resistance for Cu-Al alloys was found relevant to the maintenance of the thin Al2O3 layer at the Cu2O/Cu-Al alloy interface.

AB - Copper was alloyed with small amounts of Al (0.2, 0.5, 1.0 and 2.0 mass%) to improve the oxidation resistance. Copper (6 N) and the Cu-Al alloys were oxidized at 773-1173 K in 0.1 MPa oxygen atmosphere after hydrogen annealing at 873 K. Continuous very thin Al2O3 layers were formed on the surface of all Cu-Al dilute alloys during the hydrogen annealing. Oxidation resistance of Cu-Al alloys was improved especially for Cu-2.0Al at 773-973 K, while it decreases on increasing the oxidation temperature. Cu-Al alloys followed the parabolic rate law at 1173 K, but most of other cases do not at and below 1073 K. Oxidation resistance for Cu-Al alloys was found relevant to the maintenance of the thin Al2O3 layer at the Cu2O/Cu-Al alloy interface.

KW - Cu-Al alloy

KW - Diffusion

KW - Oxidation kinetic

KW - Oxidation resistance

KW - Secondary ion mass spectroscopy (SIMS)

KW - Surface AlO layer

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