RIE of solenoidal microcoil glass mould with integrated sample container for Micro-MRI

Mona J K Klein, Takahito Ono, Masayoshi Esashi, J. G. Korvink

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

We report the fabrication of a solenoidal microcoil mould structure based on reactive ion etching (RIE) of 100 μm thick borosilicate glass wafers. For magnetic resonance imaging (MRI), glass has superior properties compared to silicon, e.g. the lower dielectric constant and transparency. Double-side polished substrates are pre-etched in a two step process, and then anodically bonded together to achieve a hollow structure inside the coil to serve as a sample container. Two additional etch steps that are each performed on the top and bottom surfaces of the bonded wafers complete the solenoidal coil mould structure.

Original languageEnglish
Title of host publicationProceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007
Pages345-348
Number of pages4
Publication statusPublished - 2007 Dec 1
Event20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007 - Kobe, Japan
Duration: 2007 Jan 212007 Jan 25

Other

Other20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007
CountryJapan
CityKobe
Period07/1/2107/1/25

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

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