TY - GEN
T1 - RFIC flip-chip interconnection using a fiber type anisotropic conductive film
AU - Owada, Takeo
AU - Motoyoshi, Mizuki
AU - Kameda, Suguru
AU - Suematsu, Noriharu
AU - Takagi, Tadashi
AU - Tsubouchi, Kazuo
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2016/1/8
Y1 - 2016/1/8
N2 - Recently, RFIC flip-chip mounting technique is very important to make small size and high frequency transceivers like mobile phones. The conventional flip-chip mounting uses Au stud bump bonding (SBB) and requires complicated process which includes forming and leveling of the bumps. In order to simplify the RFIC flip-chip process, we introduce a fiber type anisotropic conductive film (ACF) adhesive. This flip-chip mounting process does not require the SBB process and is suitable for transceiver system RFIC's having large number I/O pins. The interconnection between the RFIC and the substrate is confirmed by the 3D-CT images. The RF performance of the interconnection is measured and analyzed. The measured return loss of this interconnection is more than 10dB below 4.2GHz.
AB - Recently, RFIC flip-chip mounting technique is very important to make small size and high frequency transceivers like mobile phones. The conventional flip-chip mounting uses Au stud bump bonding (SBB) and requires complicated process which includes forming and leveling of the bumps. In order to simplify the RFIC flip-chip process, we introduce a fiber type anisotropic conductive film (ACF) adhesive. This flip-chip mounting process does not require the SBB process and is suitable for transceiver system RFIC's having large number I/O pins. The interconnection between the RFIC and the substrate is confirmed by the 3D-CT images. The RF performance of the interconnection is measured and analyzed. The measured return loss of this interconnection is more than 10dB below 4.2GHz.
KW - Anisotropic conductive film
KW - Flip-chip
KW - Microwave
KW - Packaging
KW - RFIC
UR - http://www.scopus.com/inward/record.url?scp=84963563083&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84963563083&partnerID=8YFLogxK
U2 - 10.1109/RFIT.2015.7377906
DO - 10.1109/RFIT.2015.7377906
M3 - Conference contribution
AN - SCOPUS:84963563083
T3 - 2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings
SP - 118
EP - 120
BT - 2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015
Y2 - 26 August 2015 through 28 August 2015
ER -