RFIC flip-chip interconnection using a fiber type anisotropic conductive film

Takeo Owada, Mizuki Motoyoshi, Suguru Kameda, Noriharu Suematsu, Tadashi Takagi, Kazuo Tsubouchi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Recently, RFIC flip-chip mounting technique is very important to make small size and high frequency transceivers like mobile phones. The conventional flip-chip mounting uses Au stud bump bonding (SBB) and requires complicated process which includes forming and leveling of the bumps. In order to simplify the RFIC flip-chip process, we introduce a fiber type anisotropic conductive film (ACF) adhesive. This flip-chip mounting process does not require the SBB process and is suitable for transceiver system RFIC's having large number I/O pins. The interconnection between the RFIC and the substrate is confirmed by the 3D-CT images. The RF performance of the interconnection is measured and analyzed. The measured return loss of this interconnection is more than 10dB below 4.2GHz.

Original languageEnglish
Title of host publication2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages118-120
Number of pages3
ISBN (Electronic)9781467377942
DOIs
Publication statusPublished - 2016 Jan 8
EventIEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Sendai, Japan
Duration: 2015 Aug 262015 Aug 28

Publication series

Name2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings

Other

OtherIEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015
CountryJapan
CitySendai
Period15/8/2615/8/28

Keywords

  • Anisotropic conductive film
  • Flip-chip
  • Microwave
  • Packaging
  • RFIC

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering

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  • Cite this

    Owada, T., Motoyoshi, M., Kameda, S., Suematsu, N., Takagi, T., & Tsubouchi, K. (2016). RFIC flip-chip interconnection using a fiber type anisotropic conductive film. In 2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings (pp. 118-120). [7377906] (2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/RFIT.2015.7377906