@inproceedings{f594d1e06c12456788bdf530ab541993,
title = "RFIC flip-chip interconnection using a fiber type anisotropic conductive film",
abstract = "Recently, RFIC flip-chip mounting technique is very important to make small size and high frequency transceivers like mobile phones. The conventional flip-chip mounting uses Au stud bump bonding (SBB) and requires complicated process which includes forming and leveling of the bumps. In order to simplify the RFIC flip-chip process, we introduce a fiber type anisotropic conductive film (ACF) adhesive. This flip-chip mounting process does not require the SBB process and is suitable for transceiver system RFIC's having large number I/O pins. The interconnection between the RFIC and the substrate is confirmed by the 3D-CT images. The RF performance of the interconnection is measured and analyzed. The measured return loss of this interconnection is more than 10dB below 4.2GHz.",
keywords = "Anisotropic conductive film, Flip-chip, Microwave, Packaging, RFIC",
author = "Takeo Owada and Mizuki Motoyoshi and Suguru Kameda and Noriharu Suematsu and Tadashi Takagi and Kazuo Tsubouchi",
year = "2016",
month = jan,
day = "8",
doi = "10.1109/RFIT.2015.7377906",
language = "English",
series = "2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "118--120",
booktitle = "2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings",
note = "IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 ; Conference date: 26-08-2015 Through 28-08-2015",
}