RFIC flip-chip interconnection using a fiber type anisotropic conductive film

Takeo Owada; Mizuki Motoyoshi; Suguru Kameda; Noriharu Suematsu; Tadashi Takagi; Kazuo Tsubouchi

doi:10.1109/RFIT.2015.7377906

RFIC flip-chip interconnection using a fiber type anisotropic conductive film

Takeo Owada, Mizuki Motoyoshi, Suguru Kameda, Noriharu Suematsu, Tadashi Takagi, Kazuo Tsubouchi

Broadband Engineering Division

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Recently, RFIC flip-chip mounting technique is very important to make small size and high frequency transceivers like mobile phones. The conventional flip-chip mounting uses Au stud bump bonding (SBB) and requires complicated process which includes forming and leveling of the bumps. In order to simplify the RFIC flip-chip process, we introduce a fiber type anisotropic conductive film (ACF) adhesive. This flip-chip mounting process does not require the SBB process and is suitable for transceiver system RFIC's having large number I/O pins. The interconnection between the RFIC and the substrate is confirmed by the 3D-CT images. The RF performance of the interconnection is measured and analyzed. The measured return loss of this interconnection is more than 10dB below 4.2GHz.

Original language	English
Title of host publication	2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	118-120
Number of pages	3
ISBN (Electronic)	9781467377942
DOIs	https://doi.org/10.1109/RFIT.2015.7377906
Publication status	Published - 2016 Jan 8
Event	IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Sendai, Japan Duration: 2015 Aug 26 → 2015 Aug 28

Publication series

Name	2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings

Other

Other	IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015
Country/Territory	Japan
City	Sendai
Period	15/8/26 → 15/8/28

Keywords

Anisotropic conductive film
Flip-chip
Microwave
Packaging
RFIC

ASJC Scopus subject areas

Computer Networks and Communications
Electrical and Electronic Engineering

Access to Document

10.1109/RFIT.2015.7377906

Cite this

Owada, T., Motoyoshi, M., Kameda, S., Suematsu, N., Takagi, T., & Tsubouchi, K. (2016). RFIC flip-chip interconnection using a fiber type anisotropic conductive film. In 2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings (pp. 118-120). [7377906] (2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/RFIT.2015.7377906

RFIC flip-chip interconnection using a fiber type anisotropic conductive film. / Owada, Takeo; Motoyoshi, Mizuki; Kameda, Suguru; Suematsu, Noriharu; Takagi, Tadashi; Tsubouchi, Kazuo.

2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2016. p. 118-120 7377906 (2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Owada, T, Motoyoshi, M, Kameda, S, Suematsu, N, Takagi, T & Tsubouchi, K 2016, RFIC flip-chip interconnection using a fiber type anisotropic conductive film. in 2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings., 7377906, 2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings, Institute of Electrical and Electronics Engineers Inc., pp. 118-120, IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015, Sendai, Japan, 15/8/26. https://doi.org/10.1109/RFIT.2015.7377906

Owada T, Motoyoshi M, Kameda S, Suematsu N, Takagi T, Tsubouchi K. RFIC flip-chip interconnection using a fiber type anisotropic conductive film. In 2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2016. p. 118-120. 7377906. (2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings). https://doi.org/10.1109/RFIT.2015.7377906

Owada, Takeo ; Motoyoshi, Mizuki ; Kameda, Suguru ; Suematsu, Noriharu ; Takagi, Tadashi ; Tsubouchi, Kazuo. / RFIC flip-chip interconnection using a fiber type anisotropic conductive film. 2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 118-120 (2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings).

@inproceedings{f594d1e06c12456788bdf530ab541993,

title = "RFIC flip-chip interconnection using a fiber type anisotropic conductive film",

abstract = "Recently, RFIC flip-chip mounting technique is very important to make small size and high frequency transceivers like mobile phones. The conventional flip-chip mounting uses Au stud bump bonding (SBB) and requires complicated process which includes forming and leveling of the bumps. In order to simplify the RFIC flip-chip process, we introduce a fiber type anisotropic conductive film (ACF) adhesive. This flip-chip mounting process does not require the SBB process and is suitable for transceiver system RFIC's having large number I/O pins. The interconnection between the RFIC and the substrate is confirmed by the 3D-CT images. The RF performance of the interconnection is measured and analyzed. The measured return loss of this interconnection is more than 10dB below 4.2GHz.",

keywords = "Anisotropic conductive film, Flip-chip, Microwave, Packaging, RFIC",

author = "Takeo Owada and Mizuki Motoyoshi and Suguru Kameda and Noriharu Suematsu and Tadashi Takagi and Kazuo Tsubouchi",

note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 ; Conference date: 26-08-2015 Through 28-08-2015",

year = "2016",

month = jan,

day = "8",

doi = "10.1109/RFIT.2015.7377906",

language = "English",

series = "2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "118--120",

booktitle = "2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings",

}

TY - GEN

T1 - RFIC flip-chip interconnection using a fiber type anisotropic conductive film

AU - Owada, Takeo

AU - Motoyoshi, Mizuki

AU - Kameda, Suguru

AU - Suematsu, Noriharu

AU - Takagi, Tadashi

AU - Tsubouchi, Kazuo

PY - 2016/1/8

Y1 - 2016/1/8

N2 - Recently, RFIC flip-chip mounting technique is very important to make small size and high frequency transceivers like mobile phones. The conventional flip-chip mounting uses Au stud bump bonding (SBB) and requires complicated process which includes forming and leveling of the bumps. In order to simplify the RFIC flip-chip process, we introduce a fiber type anisotropic conductive film (ACF) adhesive. This flip-chip mounting process does not require the SBB process and is suitable for transceiver system RFIC's having large number I/O pins. The interconnection between the RFIC and the substrate is confirmed by the 3D-CT images. The RF performance of the interconnection is measured and analyzed. The measured return loss of this interconnection is more than 10dB below 4.2GHz.

AB - Recently, RFIC flip-chip mounting technique is very important to make small size and high frequency transceivers like mobile phones. The conventional flip-chip mounting uses Au stud bump bonding (SBB) and requires complicated process which includes forming and leveling of the bumps. In order to simplify the RFIC flip-chip process, we introduce a fiber type anisotropic conductive film (ACF) adhesive. This flip-chip mounting process does not require the SBB process and is suitable for transceiver system RFIC's having large number I/O pins. The interconnection between the RFIC and the substrate is confirmed by the 3D-CT images. The RF performance of the interconnection is measured and analyzed. The measured return loss of this interconnection is more than 10dB below 4.2GHz.

KW - Anisotropic conductive film

KW - Flip-chip

KW - Microwave

KW - Packaging

KW - RFIC

UR - http://www.scopus.com/inward/record.url?scp=84963563083&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84963563083&partnerID=8YFLogxK

U2 - 10.1109/RFIT.2015.7377906

DO - 10.1109/RFIT.2015.7377906

M3 - Conference contribution

AN - SCOPUS:84963563083

T3 - 2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings

SP - 118

EP - 120

BT - 2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015

Y2 - 26 August 2015 through 28 August 2015

ER -

RFIC flip-chip interconnection using a fiber type anisotropic conductive film

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