Abstract
Low-temperature bonding is an important fabrication technique for advanced microelectronics, microelectromechanical systems (MEMS), and optoelectronic devices. Recently, many low-temperature bonding techniques such as surface activated bonding have been studied in order to create unique device structures for a wide range of photonics applications. This paper focuses on low-temperature bonding techniques and reviews the state-of-the-art applications involving optoelectronic devices.
| Original language | English |
|---|---|
| Pages (from-to) | 159-165 |
| Number of pages | 7 |
| Journal | Electronics and Communications in Japan |
| Volume | 99 |
| Issue number | 3 |
| DOIs | |
| Publication status | Published - 2016 Mar 1 |
| Externally published | Yes |
Keywords
- low-temperature bonding
- optoelectronics
- room-temperature bonding
- wafer bonding
ASJC Scopus subject areas
- Signal Processing
- Physics and Astronomy(all)
- Computer Networks and Communications
- Electrical and Electronic Engineering
- Applied Mathematics