Resonance-free millimeter-wave coplanar waveguide Si microelectromechanical system package using a lightly-doped silicon chip carrier

Yo Tak Song, Hai Young Lee, Masayoshi Esashi

Research output: Contribution to journalArticle

Abstract

A silicon (Si) microelectromechanical system (MEMS) package using a lightly-doped Si chip carrier for coplanar waveguide (CPW) microwave and millimeter-wave integrated circuits (MMICs) is proposed in order to reduce parasitic problems of leakage, coupling, and resonance. The proposed chip carrier scheme is verified by fabricating and measuring a GaAs CPW on two types of carriers (conductor-back metal and lightly-doped Si) in the frequency range 0.5 to 40 GHz. The proposed MEMS package using the lightly-doped (15 Ω·cm) Si chip carrier and the high resistivity silicon (HRS, 15 kΩ·cm) shows the low loss and resonance-free since the lightly-doped Si chip carrier effectively absorbs and suppresses the resonant leakage. The Si MEMS package for CPW MMICs has an insertion loss (S 21) of 2.0dB, a reflection loss (S11) of 10dB, and a power loss (PL) of 7.5 dB at 40 GHz.

Original languageEnglish
Pages (from-to)1693-1697
Number of pages5
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume44
Issue number4 A
DOIs
Publication statusPublished - 2005 Apr 1

Keywords

  • CPW
  • HRS
  • MEMS
  • MMICs
  • Package
  • Silicon

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

Fingerprint Dive into the research topics of 'Resonance-free millimeter-wave coplanar waveguide Si microelectromechanical system package using a lightly-doped silicon chip carrier'. Together they form a unique fingerprint.

  • Cite this