Resonance-free HRS MEMS package for microwave and millimeter-wave

Yo Tak Song, Takahito Ono, Hai Young Lee, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

A silicon (Si) micro electro mechanical system (MEMS) package using a lightly-doped Si chip carrier for coplanar waveguide (CPW) microwave and millimeter-wave integrated circuits (MMICs) is proposed in order to reduce parasitic problems of leakage, coupling, and resonance. The proposed chip carrier scheme is verified by fabricating and measuring a high resistivity silicon (MRS, 10 kΩ·cm) CPW on three types of carriers (conductor-back metal, lightly-doped Si, and HRS) in the frequency range 0.5 to 40 GHz. The proposed MEMS package using the lightly-doped (15 Ω·cm) Si chip carrier and the HRS shows the low loss and resonance-free since the lightly-doped Si chip carrier effectively absorbs and suppresses the resonant leakage. The Si MEMS package for CPW MMICs has an insertion loss (S 21) of 2.0 dB, a reflection loss (S 11) of 10 dB, and a power loss (PL) of 6.0 dB up to 40 GHz.

Original languageEnglish
Title of host publicationTRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers
Pages427-432
Number of pages6
Volume1
Publication statusPublished - 2005 Nov 9
Event13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05 - Seoul, Korea, Republic of
Duration: 2005 Jun 52005 Jun 9

Other

Other13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05
CountryKorea, Republic of
CitySeoul
Period05/6/505/6/9

Keywords

  • CPW
  • HRS
  • MEMS
  • Package
  • Si

ASJC Scopus subject areas

  • Engineering(all)

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