Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device

Y. Yamada, Y. Takaku, Y. Yagi, I. Nakagawa, T. Atsumi, M. Shirai, Ikuo Ohnuma, K. Ishida

Research output: Contribution to journalArticle

80 Citations (Scopus)

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Engineering & Materials Science

Chemical Compounds

Physics & Astronomy