Reliability of flip chip package depending on underfill encapsulating processes

Satoru Katsurayama; Masumi Saka

doi:10.1115/IPACK2007-33562

Reliability of flip chip package depending on underfill encapsulating processes

Satoru Katsurayama, Masumi Saka

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Recently, we found a guideline to grasp the relationship between generated stresses, strain at any interface in a flip chip (F/C) package and warpage. Additionally, we found a possibility that generated stress and strain at any interface could be controlled by assembly process up to encapsulating even if same package was used. In the present paper, in order to understand the further details of the mechanism of package deformation, we investigate difference in warpage dependent on the encapsulation processes of capillary underfill (CUF) and no flow underfill (NUF), using same material as underfill (UF) and same F/C package structure. And we discuss package warpage and reliability dependent on encapsulation processes.

Original language	English
Title of host publication	2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Pages	9-12
Number of pages	4
DOIs	https://doi.org/10.1115/IPACK2007-33562
Publication status	Published - 2007
Externally published	Yes
Event	ASME Electronic and Photonics Packaging Division - Vancouver, BC, United States Duration: 2007 Jul 8 → 2007 Jul 12

Publication series

Name	2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Volume	2

Other

Other	ASME Electronic and Photonics Packaging Division
Country/Territory	United States
City	Vancouver, BC
Period	07/7/8 → 07/7/12

ASJC Scopus subject areas

Computer Networks and Communications
Computer Science Applications
Information Systems

Access to Document

10.1115/IPACK2007-33562

Cite this

Katsurayama, S & Saka, M 2007, Reliability of flip chip package depending on underfill encapsulating processes. in 2007 Proceedings of the ASME InterPack Conference, IPACK 2007. 2007 Proceedings of the ASME InterPack Conference, IPACK 2007, vol. 2, pp. 9-12, ASME Electronic and Photonics Packaging Division, Vancouver, BC, United States, 07/7/8. https://doi.org/10.1115/IPACK2007-33562

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title = "Reliability of flip chip package depending on underfill encapsulating processes",

abstract = "Recently, we found a guideline to grasp the relationship between generated stresses, strain at any interface in a flip chip (F/C) package and warpage. Additionally, we found a possibility that generated stress and strain at any interface could be controlled by assembly process up to encapsulating even if same package was used. In the present paper, in order to understand the further details of the mechanism of package deformation, we investigate difference in warpage dependent on the encapsulation processes of capillary underfill (CUF) and no flow underfill (NUF), using same material as underfill (UF) and same F/C package structure. And we discuss package warpage and reliability dependent on encapsulation processes.",

author = "Satoru Katsurayama and Masumi Saka",

year = "2007",

doi = "10.1115/IPACK2007-33562",

language = "English",

isbn = "0791842770",

series = "2007 Proceedings of the ASME InterPack Conference, IPACK 2007",

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note = "ASME Electronic and Photonics Packaging Division ; Conference date: 08-07-2007 Through 12-07-2007",

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AU - Katsurayama, Satoru

AU - Saka, Masumi

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AB - Recently, we found a guideline to grasp the relationship between generated stresses, strain at any interface in a flip chip (F/C) package and warpage. Additionally, we found a possibility that generated stress and strain at any interface could be controlled by assembly process up to encapsulating even if same package was used. In the present paper, in order to understand the further details of the mechanism of package deformation, we investigate difference in warpage dependent on the encapsulation processes of capillary underfill (CUF) and no flow underfill (NUF), using same material as underfill (UF) and same F/C package structure. And we discuss package warpage and reliability dependent on encapsulation processes.

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T3 - 2007 Proceedings of the ASME InterPack Conference, IPACK 2007

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Reliability of flip chip package depending on underfill encapsulating processes

Abstract

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