TY - GEN
T1 - Reliability of flip chip package depending on underfill encapsulating processes
AU - Katsurayama, Satoru
AU - Saka, Masumi
PY - 2007
Y1 - 2007
N2 - Recently, we found a guideline to grasp the relationship between generated stresses, strain at any interface in a flip chip (F/C) package and warpage. Additionally, we found a possibility that generated stress and strain at any interface could be controlled by assembly process up to encapsulating even if same package was used. In the present paper, in order to understand the further details of the mechanism of package deformation, we investigate difference in warpage dependent on the encapsulation processes of capillary underfill (CUF) and no flow underfill (NUF), using same material as underfill (UF) and same F/C package structure. And we discuss package warpage and reliability dependent on encapsulation processes.
AB - Recently, we found a guideline to grasp the relationship between generated stresses, strain at any interface in a flip chip (F/C) package and warpage. Additionally, we found a possibility that generated stress and strain at any interface could be controlled by assembly process up to encapsulating even if same package was used. In the present paper, in order to understand the further details of the mechanism of package deformation, we investigate difference in warpage dependent on the encapsulation processes of capillary underfill (CUF) and no flow underfill (NUF), using same material as underfill (UF) and same F/C package structure. And we discuss package warpage and reliability dependent on encapsulation processes.
UR - http://www.scopus.com/inward/record.url?scp=40449113341&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=40449113341&partnerID=8YFLogxK
U2 - 10.1115/IPACK2007-33562
DO - 10.1115/IPACK2007-33562
M3 - Conference contribution
AN - SCOPUS:40449113341
SN - 0791842770
SN - 9780791842775
T3 - 2007 Proceedings of the ASME InterPack Conference, IPACK 2007
SP - 9
EP - 12
BT - 2007 Proceedings of the ASME InterPack Conference, IPACK 2007
T2 - ASME Electronic and Photonics Packaging Division
Y2 - 8 July 2007 through 12 July 2007
ER -