Reliability of flip chip package depending on underfill encapsulating processes

Satoru Katsurayama, Masumi Saka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Recently, we found a guideline to grasp the relationship between generated stresses, strain at any interface in a flip chip (F/C) package and warpage. Additionally, we found a possibility that generated stress and strain at any interface could be controlled by assembly process up to encapsulating even if same package was used. In the present paper, in order to understand the further details of the mechanism of package deformation, we investigate difference in warpage dependent on the encapsulation processes of capillary underfill (CUF) and no flow underfill (NUF), using same material as underfill (UF) and same F/C package structure. And we discuss package warpage and reliability dependent on encapsulation processes.

Original languageEnglish
Title of host publication2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Pages9-12
Number of pages4
DOIs
Publication statusPublished - 2007 Dec 1
EventASME Electronic and Photonics Packaging Division - Vancouver, BC, United States
Duration: 2007 Jul 82007 Jul 12

Publication series

Name2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Volume2

Other

OtherASME Electronic and Photonics Packaging Division
CountryUnited States
CityVancouver, BC
Period07/7/807/7/12

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Computer Science Applications
  • Information Systems

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