Relation between oxidation rate and oxidation-induced strain at SiO 2/Si(001) interfaces during thermal oxidation

Shuichi Ogawa, Jiayi Tang, Akitaka Yoshigoe, Shinji Ishidzuka, Yuden Teraoka, Yuji Takakuwa

Research output: Contribution to journalArticlepeer-review

9 Citations (Scopus)


To experimentally verify the Si oxidation reaction model mediated by point defect (emitted Si atoms and their vacancies) generation due to oxidation-induced strain, real-time photoelectron spectroscopy using synchrotron radiation was employed to simultaneously evaluate the amount of oxidation-induced strained Si atoms at the SiO2/Si interface, oxidation state, and oxidation rate during oxidation on n-type Si(001) surfaces with O2 gas. It is found that both the oxidation rate and the amount of strained Si atoms at the completion of the first-oxide-layer growth decrease gradually with increasing temperature from 300 to 550 °C, where the oxide grows in the Langmuir-type adsorption manner. It is found that the interface strain and oxidation rate have a strong correlation. We discuss the reason for the oxide coverage and oxidation temperature dependences of interfacial strain from the viewpoint of the behavior of adsorbed oxygen during the first-oxide-layer growth.

Original languageEnglish
Article number110128
JournalJapanese journal of applied physics
Issue number11 PART 1
Publication statusPublished - 2013 Nov 1

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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