Reduction of moisture in semiconductor dry process equipment by generating extremely low oxygen ambience

Kazuhiko Endo, Naoki Shirakawa, Yoshiyuki Yoshida, Takeshi Iwase, Tetsuya Mino

Research output: Contribution to journalArticlepeer-review

Abstract

The decomposition of moisture has been enhanced by reducing oxygen in process gases, and extremely low moisture gases have been successfully generated. An oxygen reduction system using a solid electrolyte has been used to reduce oxygen and enhance the decomposition of moisture. A marked increase in the evacuation speed of a process chamber has been successfully demonstrated when flushing with an extremely low moisture gas.

Original languageEnglish
Pages (from-to)08HH011-08HH012
JournalJapanese journal of applied physics
Volume48
Issue number8 Part 2
DOIs
Publication statusPublished - 2009 Dec 1
Externally publishedYes

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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