Reduction of diffusion bonding temperature with recrystallization at austenitic stainless steel

Masahito Katoh, Naoko Sato, Tomomi Shiratori, Yohei Suzuki

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

Abstract

Diffusion bonding at low temperature is a necessary process for the manufacturing of metal MEMS (Micro-Electronic-Mechanical Systems) such as, in the case of metal micro-pump that requires a high proof strength. Metals with severe plastic deformation having high mobility grain boundaries are known to bond at low temperatures. We then simultaneously carried out recrystallization and solid phase diffusion bonding of the metals. In this paper, we have confirmed a reduction in the diffusion bonding temperature in severe plastic-deformed SUS304 and SUS316L as compared to the case of heat treated solutions. Especially the bonding temperature was decreased considerably in SUS304 having strain-induced martensite.

Original languageEnglish
Pages (from-to)34-39
Number of pages6
JournalTetsu-To-Hagane/Journal of the Iron and Steel Institute of Japan
Volume102
Issue number1
DOIs
Publication statusPublished - 2016
Externally publishedYes

Keywords

  • Diffusion bonding
  • Fine grain size
  • Recrystallization
  • Stainless steel
  • Super plasticity

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Physical and Theoretical Chemistry
  • Metals and Alloys
  • Materials Chemistry

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