TY - GEN
T1 - Recovery of plasma-induced mechanical damage in resonators using Neutral Beam Etching
T2 - 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
AU - Nishimori, Y.
AU - Ueki, S.
AU - Miwa, K.
AU - Kubota, T.
AU - Samukawa, S.
AU - Hashiguchi, G.
AU - Sugiyama, M.
PY - 2012
Y1 - 2012
N2 - As an effective application of Neutral Beam Etching (NBE) to MEMS, we here propose a combined approach with conventional plasma process and NBE: removal of plasma-induced damage by NBE. If it is possible, we can obtain a damage-free surface for MEMS devices without a high-temperature annealing process. In order to evaluate the effect of this combined approach quantitatively; we focused on the resonance of a micro cantilever and derived a parameter of surface damage (δE ds) theoretically from Q-factor and resonance frequency. And then we examined the change in δE ds of the cantilevers on an 8-inch wafer before and after NBE treatment. The initial surface of cantilevers had been damaged by plasma processes during their fabrication, and the removal of those damage by NBE was confirmed as the reduction in δE ds.
AB - As an effective application of Neutral Beam Etching (NBE) to MEMS, we here propose a combined approach with conventional plasma process and NBE: removal of plasma-induced damage by NBE. If it is possible, we can obtain a damage-free surface for MEMS devices without a high-temperature annealing process. In order to evaluate the effect of this combined approach quantitatively; we focused on the resonance of a micro cantilever and derived a parameter of surface damage (δE ds) theoretically from Q-factor and resonance frequency. And then we examined the change in δE ds of the cantilevers on an 8-inch wafer before and after NBE treatment. The initial surface of cantilevers had been damaged by plasma processes during their fabrication, and the removal of those damage by NBE was confirmed as the reduction in δE ds.
UR - http://www.scopus.com/inward/record.url?scp=84860442608&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84860442608&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2012.6170157
DO - 10.1109/MEMSYS.2012.6170157
M3 - Conference contribution
AN - SCOPUS:84860442608
SN - 9781467303248
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 313
EP - 316
BT - 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
Y2 - 29 January 2012 through 2 February 2012
ER -