Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers

Kanuku Ri, C. Nagai, A. Nakamura, H. Aizawa, Jichoru Be, Mitsumasa Koyanagi, H. Hashiguchi, Takafumi Fukushima, Tetsu Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

High yield reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology is proposed for ultra-high density 2.5D/3D integration applications. New mCoW hybrid bonding technology use shallow-recess oxide structure, electro-less plated capping layers, and thin glue adhesive layer below 1um to avoid the issues of current standard CoW bonding technology. Multi numbers of TEG die with 7mm × 23mm size are simultaneously aligned with high accuracy around 1um using chip self-assembly technology and thermal-compression bonded by in batch. In the TEG chip, totally 684,000 electrode daisy chain comprising of 3um diameter/6um pitch tiny Cu electrodes are well intact joined by new reconfigured mCoW hybrid bonding technology.

Original languageEnglish
Title of host publication2015 International 3D Systems Integration Conference, 3DIC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
PagesTS1.2.1-TS1.2.4
ISBN (Electronic)9781467393850
DOIs
Publication statusPublished - 2015 Nov 20
EventInternational 3D Systems Integration Conference, 3DIC 2015 - Sendai, Japan
Duration: 2015 Aug 312015 Sep 2

Publication series

Name2015 International 3D Systems Integration Conference, 3DIC 2015

Other

OtherInternational 3D Systems Integration Conference, 3DIC 2015
CountryJapan
CitySendai
Period15/8/3115/9/2

Keywords

  • extrude Cu
  • reconfigured multichip-on-wafer hybrid bonding
  • terascale 2.5D/3D

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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