Recent progresses of application-oriented MEMS through industry-university collaboration

Masayoshi Esashi

doi:10.1142/S0129156406003941

Recent progresses of application-oriented MEMS through industry-university collaboration

Masayoshi Esashi

Micro System Integration Center (μSIC)

Research output: Contribution to journal › Article › peer-review

Abstract

MEMS research has been carried out through industry-university (Tohoku) collaboration for practical applications. Sophisticated devices such as electrostatically levitated rotational gyroscope, MEMS relay for wafer level packaging, array MEMS including multi-probe data storage and multi-column electron beam lithography system, small diameter fiber optic pressure sensor and SiC micro structure for glass press molding, have been developed. Electrical feedthroughs in glass play important role in the wafer level packaging and array MEMS. Materials such as conductive polymer for recording media, carbon nanotube for electron field emitter, SiC for harsh environment are used in these MEMS because of their unique features.

Original language	English
Pages (from-to)	693-704
Number of pages	12
Journal	International Journal of High Speed Electronics and Systems
Volume	16
Issue number	2
DOIs	https://doi.org/10.1142/S0129156406003941
Publication status	Published - 2006 Jun 1

Keywords

MEMS
Sensor

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1142/S0129156406003941

Cite this

@article{2d9d2eb7fb494e139829379db9faf6f7,

title = "Recent progresses of application-oriented MEMS through industry-university collaboration",

abstract = "MEMS research has been carried out through industry-university (Tohoku) collaboration for practical applications. Sophisticated devices such as electrostatically levitated rotational gyroscope, MEMS relay for wafer level packaging, array MEMS including multi-probe data storage and multi-column electron beam lithography system, small diameter fiber optic pressure sensor and SiC micro structure for glass press molding, have been developed. Electrical feedthroughs in glass play important role in the wafer level packaging and array MEMS. Materials such as conductive polymer for recording media, carbon nanotube for electron field emitter, SiC for harsh environment are used in these MEMS because of their unique features.",

keywords = "MEMS, Sensor",

author = "Masayoshi Esashi",

year = "2006",

month = jun,

day = "1",

doi = "10.1142/S0129156406003941",

language = "English",

volume = "16",

pages = "693--704",

journal = "International Journal of High Speed Electronics and Systems",

issn = "0129-1564",

publisher = "World Scientific Publishing Co. Pte Ltd",

number = "2",

}

TY - JOUR

T1 - Recent progresses of application-oriented MEMS through industry-university collaboration

AU - Esashi, Masayoshi

PY - 2006/6/1

Y1 - 2006/6/1

N2 - MEMS research has been carried out through industry-university (Tohoku) collaboration for practical applications. Sophisticated devices such as electrostatically levitated rotational gyroscope, MEMS relay for wafer level packaging, array MEMS including multi-probe data storage and multi-column electron beam lithography system, small diameter fiber optic pressure sensor and SiC micro structure for glass press molding, have been developed. Electrical feedthroughs in glass play important role in the wafer level packaging and array MEMS. Materials such as conductive polymer for recording media, carbon nanotube for electron field emitter, SiC for harsh environment are used in these MEMS because of their unique features.

AB - MEMS research has been carried out through industry-university (Tohoku) collaboration for practical applications. Sophisticated devices such as electrostatically levitated rotational gyroscope, MEMS relay for wafer level packaging, array MEMS including multi-probe data storage and multi-column electron beam lithography system, small diameter fiber optic pressure sensor and SiC micro structure for glass press molding, have been developed. Electrical feedthroughs in glass play important role in the wafer level packaging and array MEMS. Materials such as conductive polymer for recording media, carbon nanotube for electron field emitter, SiC for harsh environment are used in these MEMS because of their unique features.

KW - MEMS

KW - Sensor

UR - http://www.scopus.com/inward/record.url?scp=33748467639&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33748467639&partnerID=8YFLogxK

U2 - 10.1142/S0129156406003941

DO - 10.1142/S0129156406003941

M3 - Article

AN - SCOPUS:33748467639

VL - 16

SP - 693

EP - 704

JO - International Journal of High Speed Electronics and Systems

JF - International Journal of High Speed Electronics and Systems

SN - 0129-1564

IS - 2

ER -

Recent progresses of application-oriented MEMS through industry-university collaboration

Abstract

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this