Recent progress in 3D integration technology

Mitsumasa Koyanagi

Research output: Contribution to journalReview article

12 Citations (Scopus)

Abstract

3D integration technology is the key for future LSIs with highperformance, low-power and multi-functionality. Especially, to mitigate various concerns caused by device scaling down to 10 nm or less, it is indispensable to introduce a new concept of heterogeneous 3D integration in which various kinds of materials, devices and technologies are integrated on a Si substrate. Future prospects of such a heterogeneous 3D integration technology has been discussed representing typical examples of heterogeneous 3D LSIs after the present situation of 3D integration technology is described.

Original languageEnglish
JournalIEICE Electronics Express
Volume12
Issue number7
DOIs
Publication statusPublished - 2015 Apr 10

Keywords

  • 3D DRAM
  • 3D image sensor
  • 3D integration
  • 3D microprocessor
  • Heterogeneous integration
  • TSV

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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